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Yoonchul Sohn

Observed names: Sohn Yoon-Chul, Sohn Yoonchul, Y C Sohn, Y. C. SOHN, Y. C. Sohn, Y.C. Sohn, Yoon Chul Sohn, Yoon-Chul Sohn, YoonChul Sohn
Institution: Chosun University
ORCID: 0000-0002-7993-7108
Observed ORCIDs: 0000-0002-7993-7108, 0000-0003-1321-5230
OpenAlex ID: A5039369795
A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding
2015 · Kunmo Chu, Yoonchul Sohn, et al. · Scripta Materialia · 117
Electrical and Thermal Properties of Carbon-Nanotube Composite for Flexible Electric Heating-Unit Applications
2013 · Kunmo Chu, Dongouk Kim, et al. · IEEE Electron Device Letters · 97
Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization
2004 · Y.C. Sohn, Jin Yu, et al. · Journal of materials research/Pratt's guide to venture capital sources · 95
Metallic conduction induced by direct anion site doping in layered SnSe2
2016 · Sang Il Kim, Sungwoo Hwang, et al. · Scientific Reports · 60
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Effect of Cu content on the mechanical reliability of Ni/Sn–3.5Ag system
2007 · J.Y. Kim, Y.C. Sohn, et al. · Journal of materials research/Pratt's guide to venture capital sources · 59
Design of multi-functional dual hole patterned carbon nanotube composites with superhydrophobicity and durability
2013 · Sung-Hoon Park, Eun-Hyoung Cho, et al. · Nano Research · 49
Correlation Between Chemical Reaction and Brittle Fracture Found in Electroless Ni(P)/immersion gold–solder Interconnection
2005 · Yoon-Chul Sohn, Jin Yu · Journal of materials research/Pratt's guide to venture capital sources · 48
Anti-frost coatings containing carbon nanotube composite with reliable thermal cyclic property
2014 · Yoonchul Sohn, Dongouk Kim, et al. · Journal of Materials Chemistry A · 37
Study of the reaction mechanism between electroless Ni–P and Sn and its effect on the crystallization of Ni–P
2003 · Y. C. Sohn, Jin Yu, et al. · Journal of materials research/Pratt's guide to venture capital sources · 34
Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P
2004 · Y. C. Sohn, Jin Yu, et al. · Journal of Electronic Materials · 33
Wafer-level low temperature bonding with Au-In system
2007 · Yoon-Chul Sohn, Qian Wang, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 27
Suppression of negative temperature coefficient of resistance of multiwalled nanotube/silicone rubber composite through segregated conductive network and its application to laser-printing fusing element
2016 · Sang-Eui Lee, Yoonchul Sohn, et al. · Organic Electronics · 26
Flexible hybrid conductor comprising eutectic Ga-In liquid metal and Ag nanowires for the application of electronic skin
2019 · Yoonchul Sohn, Kunmo Chu · Materials Letters · 25
Friction and Wear Characteristics of Polydimethylsiloxane under Water-Based Lubrication Conditions
2022 · Sung-Jun Lee, Yoon-Chul Sohn, et al. · Materials · 21
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Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes
2022 · Hyeokgi Choi, Chang-Lae Kim, et al. · Materials · 19
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Formation and Growth of Intermetallic Compounds during Reactions between Liquid Gallium and Solid Nickel
2021 · Doyoung Lee, Chang-Lae Kim, et al. · Materials · 15
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Growth of carbon nanotube field emitters on single strand carbon fiber: a linear electron source
2011 · Ha Jin Kim, Min Jong Bae, et al. · Nanotechnology · 15
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Interfacial reactions between liquid Ga and solid Au
2022 · Hyeokgi Choi, Yoonchul Sohn · Materials Letters · 14
Temperature dependence of contact resistance at metal/MWNT interface
2016 · Sang-Eui Lee, Kyoung-Seok Moon, et al. · Applied Physics Letters · 14
Microstructural Optimization of Sn-58Bi Low-Temperature Solder Fabricated by Intense Pulsed Light (IPL) Irradiation
2024 · Hyeri Go, Taejoon Noh, et al. · Crystals · 13
Tribological Effects of Water-Based Graphene Lubricants on Graphene Coatings
2022 · Sung-Jun Lee, Yoon-Chul Sohn, et al. · Materials · 13
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Microstructure and mechanical properties of Ag nanoparticles-modified Sn–58Bi/Cu solder joints during liquid-state reaction
2021 · Dae-Young Park, Jungsoo Kim, et al. · Journal of Materials Science Materials in Electronics · 12
Analysis of intermetallic compound formation in the reactions at liquid Ga/solid Pd interface
2022 · Byungwoo Kim, Yoonchul Sohn · Surfaces and Interfaces · 10
Effect of Intermetallics Spalling on the Mechanical Behavior of Electroless Ni(P)/Pb-Free Solder Interconnection
2005 · Yoon-Chul Sohn, Jin Yu, et al. · 10
Study of IMC morphologies and phase characteristics affected by the reactions of Ni and Cu metallurgies with Pb-free solder joints
2004 · Won Kyoung Choi, Sung K. Kang, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 10
Works count: 67
Citation count: 984
H-index: 15
I10-index: 25
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