Author

Ting-Hsun Su

Institution: Feng Chia University

Observed institution: Feng Chia University

ORCID: 0009-0004-6816-9467

Observed ORCID: 0009-0004-6816-9467

OpenAlex ID: A5039388688

Tailoring superhydrophilicity and photocatalysis of sputter deposited TiO2/WO3 thin films on super white glass by process and chemical composition optimization

2022 · Sheng-Kuei Chiu, Wei-Cheng Li, et al. · Vacuum · 11

Influence of trace tungsten contents on thin-film properties and electromigration behaviors of electroless-deposited cobalt interconnect lines

2025 · Jau-Shiung Fang, Ting-Hsun Su, et al. · Materials Research Bulletin · 8

Enhancement of Electromigration Reliability of Electroless-Plated Nanoscaled Copper Interconnects by Complete Encapsulation of a 1 nm-Thin Self-Assembled Monolayer

2022 · Giin-Shan Chen, Ching-En Lee, et al. · Journal of The Electrochemical Society · 4

Synergistic enhancement of adhesion and electromigration reliability of cobalt via super-diluted (0.06 at.%) tungsten alloying as next-generation interconnect materials

2024 · Jau-Shiung Fang, Ting-Hsun Su, et al. · Microelectronics Reliability · 3

The feasibility of an ultrathin dual-barrier scheme to inhibit interfacial diffusion and reactions in contact stacks of Co/NiSi/Si

2024 · Chien-Nan Hsiao, Yen-Chang Pan, et al. · Surfaces and Interfaces · 2

Superior Electromigration Reliability of Cobalt Via Super-Diluted (0.06 At.%) Tungsten Alloying as Next-Generation Interconnect Materials

2023 · Jau-Shiung Fang, Ting-Hsun Su, et al. · SSRN Electronic Journal

Superior Electromigration Reliability of Cobalt Via Super-Diluted (0.06 At.%) Tungsten Alloying as Next-Generation Interconnect Materials

2023 · Jau-Shiung Fang, Ting-Hsun Su, et al. · SSRN Electronic Journal

Works count: 7

Citation count: 28

H-index: 3

I10-index: 1