Author

Paul Gierth

Observed names: Gierth, P., Gierth, Paul, P. Gierth

Institution: Fraunhofer Institute for Ceramic Technologies and Systems

Observed institution: Fraunhofer Institute for Ceramic Technologies and Systems

ORCID: 0000-0001-7216-0642

Observed ORCID: 0000-0001-7216-0642

OpenAlex ID: A5040001300

Evaluation of soldering processes for high efficiency solar cells

2012 · Paul Gierth, Lars Rebenklau, et al. · International Spring Seminar on Electronics Technology · 17

Novel thermocouples for automotive applications

2018 · Paul Gierth, Lars Rebenklau, et al. · Journal of sensors and sensor systems · 11

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Temperature sensors based on thermoelectric effect

2015 · Lars Rebenklau, Paul Gierth, et al. · Fraunhofer-Publica (Fraunhofer-Gesellschaft) · 11

Inert Drying System for Copper Paste Application in PV

2013 · Caroline Clement, Hans Bell, et al. · Energy Procedia · 9

Complementary EIS/FTIR study of the degradation of adhesives in electronic packaging

2020 · Michael Schneider, Uta Gierth, et al. · Materials and Corrosion · 7

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Novel thermoelectric temperature sensors

2015 · L. Rebenklau, K. Irrgang, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 6

Low Temperature Interconnection Techniques for High Efficiency Heterojunction Solar Cells

2012 · Rebenklau, L., Gierth, P., et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 6

Low temperature co-fired ceramics technology for active eddy current turbocharger speed sensors

2018 · Martin Ihle, Steffen Ziesche, et al. · Microelectronics International · 4

Degradation studies of epoxy coatings on printed circuit boards after pressure cooker test

2021 · Michael Schneider, Uta Gierth, et al. · Materials and Corrosion · 3

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Influence of Inert Curing on Polymer Paste Characteristics on High Efficency Heterojunction Solar Cells

2013 · Gierth, P., Rebenklau, L., et al. · EU PVSEC · 3

Application of (Electrochemical) Impedance Spectroscopy to Investigate the Degradation of Epoxy Mold Compounds for Plastic Encapsulation of Power Electronics—A Feasibility Study

2025 · Michael Schneider, Uta Gierth, et al. · Materials and Corrosion · 1

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A7.2 Evaluation of High Temperature Ceramic Sensor Packages

2021 · P. Gierth, L. Rebenklau, et al. · Sensor and Measurement Science International (SMSI) · 1

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Development and analysis of high temperature stable interconnections on thick films using micro resistance welding for sensors and MEMS

2018 · Paul Gierth, Lars Rebenklau · Electronic System-Integration Technology Conference (ESTC) · 1

Wettability of rapid thermal firing silver-Pastes

2014 · Paul Gierth, Lars Rebenklau · International Spring Seminar on Electronics Technology · 1

Development of Silicon Heterojunction Metal Wrap through Solar Cells

2014 · Dirnstorfer, I., Schilling, N., et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 1

Comparison of NiV and Polymer Paste Metallization as Low Temperature Interconnection for High Efficiency Heterojunction Solar Cells

2013 · Gierth, P., Rebenklau, L., et al. · EU PVSEC · 1

DATIpilot Modul 1 Innovationssprints: Anorganische Photokatalyse-Filtrationsmembranen für ein material- und energieeffizientes Wasserrecycling in industriellen Prozessen - ANKATRIN

2026 · Ehlen, Frank, Klippert, Roman, et al. · RENATE

D3-1.5 - Hochtemperatursensoren auf Basis von Keramik- Kompositwerkstoffen

2026 · B. Feng, H. -P. Martin, et al.

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C8.4 Measurement Methods for Understanding Water Uptake Processes in Polymers

2021 · P. Gierth, U. Gierth, et al.

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D4.5 Non-destructive validation method for understanding water uptake processes of moldings in electronic packaging

2020 · Paul Gierth, Lars Rebenklau, et al.

D2.4 - Novel thermocouples for temperature measurement in automotive applications

2017 · P. Gierth, L. Rebenklau, et al. · SENSOR International Conference on Sensors and Measurement Technology (SENSOR)

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P5.3 - Entwicklung neuartiger thermoelektrischer Module für automotive und industrielle Anwendungen

2016 · L. Niedermeyer, K. Augsburg, et al. · Tagungsband

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Electrical characterization of thick film materials

2015 · L. Rebenklau, P. Gierth, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)

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Solder wettability and solder joint reliability of rapid thermal firing thick film pastes

2015 · Paul Gierth, Lars Rebenklau · Fraunhofer-Publica (Fraunhofer-Gesellschaft)

Via Hole Conditioning in Silicon Heterojunction metal Wrap through Solar Cells

2015 · Ingo Dirnstorfer, Niels Schilling, et al. · Energy Procedia

Works count: 42

Citation count: 88

H-index: 6

I10-index: 3