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Michael G. Todd
Observed names:
M. Todd,
M.G. Todd,
Michael G Todd,
Michael Todd,
Todd, Michael
Observed institutions:
Innovation, Science and Economic Development Canada,
University of California, Irvine,
Henkel (United States)
OpenAlex ID:
A5040100411
Characterizing the interphase dielectric constant of polymer composite materials: Effect of chemical coupling agents
2003
·
Michael G. Todd
, Frank G. Shi
·
Journal of Applied Physics
·
176
Complex permittivity of composite systems: a comprehensive interphase approach
2005
·
M.G. Todd
, F.G. Shi
·
IEEE Transactions on Dielectrics and Electrical Insulation
·
150
Validation of a novel dielectric constant simulation model and the determination of its physical parameters
2002
·
Michael G Todd
, Frank G Shi
·
Microelectronics Journal
·
89
Towards model-based engineering of underfill materials: CTE modeling
2001
·
H.T. Vo
, M. Todd
, et al.
·
Microelectronics Journal
·
79
Molecular basis of the interphase dielectric properties of microelectronic and optoelectronic packaging materials
2003
·
M.G. Todd
, F.G. Shi
·
IEEE Transactions on Components and Packaging Technologies
·
74
N-Cyanoimides: reactivity studies with amine nucleophiles
1992
·
Randall W. Stephens
, Linda A. Domeier
, et al.
·
Tetrahedron Letters
·
25
Low Warpage Molding Compound Development for Array Packages
2006
·
K Y. Chien
, Jack Zhang
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
18
The effects of curing parameters on the properties development of an epoxy encapsulant material
2002
·
Christine Naito
, Michael Todd
·
Microelectronics Reliability
·
14
Underfill for low-k silicon technology
2004
·
S. Rajagopalan
, K. Desai
, et al.
·
IEEE/CPMT International Electronics Manufacturing Technology Symposium
·
9
Dielectric characteristics of complex composite systems containing interphase regions
2004
·
M. Todd
, F. Shi
·
IEEE Consumer Communications and Networking Conference
·
7
Effect of die attach configuration in stacked die packages
2004
·
J. Zhang
, M. Todd
, et al.
·
International Symposium on High Density packaging and Microsystem Integration
·
5
Material Systems Enable High Density Packaging
2007
·
Michael Todd
·
International Symposium on High Density packaging and Microsystem Integration
·
4
Molding Compound and Underfill Material Sets For A Molded Flip-Chip SIP Package
2006
·
J. Zhang
, M. Buckley
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
4
Effects of no-clean flux residue on the performance of flip-chip devices
2002
·
M. Todd
·
International Symposium on Advanced Packaging Materials
·
4
Comparative studies of green molding compounds for the encapsulation of Cu/low-k packages
2005
·
S. Chungpaiboonpatana
, F.G. Shi
, et al.
·
International Symposium on Advanced Packaging Materials
·
3
Stencil printing on bumped wafer for pre-applied underfill application
2004
·
Hao Tang
, G. Shi
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
3
No-clean assembly process conditions-effects on flip-chip/underfill reliability
2002
·
M. Todd
, K. Costello
·
International Symposium on Advanced Packaging Materials
·
3
Toward determining optimal mechanical properties in adhesives for flip chip and wire bonded low-k die
2004
·
G. Carson
, M. Todd
·
IEEE/CPMT International Electronics Manufacturing Technology Symposium
·
2
Modeling and experimental study for the targeted design of dielectric properties of polymer composite materials
2004
·
M. Todd
·
PhDT
·
2
Advancements in Packaging Technology Driven by Global Market Return
2010
·
Michael Todd
·
ECS Transactions
Lead Free Application of Flip Chip Underfills
2007
·
Renzhe Zhao
, Qing Ji
, et al.
·
SMTA International
Interaction of Molding Compounds with Other Packaging Components And Their Effects on Electronics Packaging Design
2006
·
Tim Chen
, Jack Zhang
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
Material Design for the Next Generation Low-K/Cu Flip-Chip Packages
2005
·
Sarathy Rajagopalan
, Kishor Desai
, et al.
·
Pan Pacific Symposium
Flip-Chip Underfill and Flux Residue Interaction in a Pb-Free Process
2004
·
Brian J. Toleno
, George Carson
, et al.
·
SMTA International
Effective Dielectric Constant of Composite Packaging Materials
2002
·
Michael Todd
, Frank Shi
·
Specialized and Legacy Electronics Manufacturing Conferences
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Works count:
28
Citation count:
671
H-index:
9
I10-index:
8
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