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Yuanshen Cheng
Institution:
Hebei GEO University
Observed institutions:
Hebei University of Technology,
Hebei GEO University
ORCID:
0000-0002-5380-9474
Observed ORCID:
0000-0002-5380-9474
OpenAlex ID:
A5040865491
Comparison of anionic surfactants dodecylbenzene sulfonic acid and 1,2,4-triazole for inhibition of Co corrosion and study of the mechanism for passivation of the Co surface by dodecylbenzene sulfonic acid
2022
·
Yuanshen Cheng
, Chenwei Wang
, et al.
·
Journal of Molecular Liquids
·
44
Study on particle removal during the Co post-CMP cleaning process
2021
·
Yuanshen Cheng
, Shengli Wang
, et al.
·
Colloids and Surfaces A Physicochemical and Engineering Aspects
·
26
Effect of Potassium Tartrate on Removal Rate Selectivity of Co/TiN/TEOS for Cobalt “Buff Step” Chemical Mechanical Planarization
2020
·
Yuanshen Cheng
, Shengli Wang
, et al.
·
ECS Journal of Solid State Science and Technology
·
24
PDF
Role of Slurry Additives on Chemical Mechanical Planarization of Silicon Dioxide Film in Colloidal Silica Based Slurry
2021
·
Yue Li
, Chenwei Wang
, et al.
·
ECS Journal of Solid State Science and Technology
·
14
PDF
Study on enhancement and mechanism of K2SO4 in CMP slurries for copper film polishing removal effect
2022
·
Nengyuan Zeng
, Yuling Liu
, et al.
·
Materials Science in Semiconductor Processing
·
7
Glycine as an Efficient Corrosion Inhibitor for TiN Oxidation Environments
2023
·
Yuanshen Cheng
, Shengli Wang
, et al.
·
ECS Journal of Solid State Science and Technology
·
5
PDF
Effect of Benzotriazole and 5-Methyl/1-H Carboxyl Benzotriazole on Chemical Mechanical Polishing of Cobalt in H 2 O 2 Based Slurry
2021
·
Shuangshuang Lei
, Shengli Wang
, et al.
·
ECS Journal of Solid State Science and Technology
·
4
PDF
Effect of Various Complexing Agents for Cobalt “bulk step” Chemical Mechanical Planarization
2020
·
Yundian Yang
, Shengli Wang
, et al.
·
China Semiconductor Technology International Conference (CSTIC)
·
2
Effect of Various Surfactants On Surface Roughness Reduction During Cobalt “Buff Step” CMP
2020
·
Yuanshen Cheng
, Shengli Wang
, et al.
·
China Semiconductor Technology International Conference (CSTIC)
·
1
The Influence of Glycine on the Removal Rate Selectivity of Titanium Nitride-Based Cobalt Interconnects
2026
·
Yuanshen Cheng
, Shengli Wang
, et al.
·
China Semiconductor Technology International Conference (CSTIC)
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Works count:
10
Citation count:
127
H-index:
5
I10-index:
4
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