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Tim Xia

OpenAlex ID: A5041282520
Panel-Level Fan-Out RDL-First Packaging for Heterogeneous Integration
2020 · John H. Lau, Cheng-Ta Ko, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 49
Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration
2020 · John H. Lau, Cheng-Ta Ko, et al. · Journal of Microelectronics and Electronic Packaging · 27
High-Density Hybrid Substrate for Heterogeneous Integration
2022 · Tony Chia-Yu Peng, John H. Lau, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 23
Fan-Out Panel-Level Packaging of Mini-LED RGB Display
2021 · John H. Lau, Cheng-Ta Ko, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 20
Development of High-Density Hybrid Substrate for Heterogeneous Integration
2021 · Chia-Yu Peng, John H Lau, et al. · IEEE CPMT Symposium Japan (ICSJ) · 16
Hybrid Substrate With Ultralarge Organic Interposer for Heterogeneous Integration
2023 · John H. Lau, Curry Lin, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 15
Panel-Level Chip-Scale Package With Multiple Diced Wafers
2020 · John H. Lau, Cheng-Ta Ko, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 15
Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications
2022 · Tzu-Nien Lee, John-H Lau, et al. · Materials · 12
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Thermal Cycling Test and Simulation of Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous Integration
2021 · John H Lau, Cheng-Ta Ko, et al. · Journal of Microelectronics and Electronic Packaging · 9
Fan-Out RDL-first Panel-Level Packaging for Heterogeneous Integration
2020 · John H Lau, Cheng-Ta Ko, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 8
Thermal Cycling Test and Simulation of Six-Side Molded Panel-Level Chip-Scale Packages (PLCSPs)
2021 · John H Lau, Cheng-Ta Ko, et al. · Journal of Microelectronics and Electronic Packaging · 6
Six-Side Molded Panel-Level Chip-Scale Package with Multiple Diced Wafers
2020 · John H. Lau, Cheng-Ta Ko, et al. · Journal of Microelectronics and Electronic Packaging · 6
Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration
2020 · John H Lau, Cheng-Ta Ko, et al. · IMAPSource Proceedings · 6
Reliability of 6-Side Molded Panel-Level Chip-Scale Packages (PLCSPs)
2021 · John H Lau, Cheng-Ta Ko, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Design, Materials, Process, Fabrication, and Reliability of Mini-LED RGB Display by Fan-Out Panel-Level Packaging
2021 · John H Lau, Cheng-Ta Ko, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Reliability of Chip-Last Fan-Out Panel-Level Packaging for Heterogeneous Integration
2021 · John H Lau, Cheng-Ta Ko, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Six-Side Molded Panel-Level Chip Scale Package with Multiple Diced Wafers
2020 · John H Lau, Cheng-Ta Ko, et al. · IMAPSource Proceedings · 3
Fan-In Panel-Level with Multiple Diced Wafers Packaging
2020 · John H Lau, Cheng-Ta Ko, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 3
Characterization of Low Loss Dielectric Materials for High-Speed and High-Frequency Applications
2022 · Tzu Nien Lee, John H Lau, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Characterization of Low Loss Dielectric Materials for 5G Applications
2021 · Tzu Nien Lee, John H Lau, et al. · IEEE CPMT Symposium Japan (ICSJ) · 1
Chiplets Heterogeneous Integration on High-Density Hybrid Substrate Using an Interconnect-Layer
2021 · Chia-Yu Peng, John H Lau, et al. · International Symposium on Microelectronics · 1
Awards from public academies as a driving force for innovation.
2026 · Tim Xia · European Journal of Technical and Natural Sciences
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ADAPTIVE ROBOTIC ECOSYSTEMS FOR WATER PURIFICATION AND ENERGY MANAGEMENT: A PROPRIETARY ARCHITECTURAL PARADIGM FOR PREDICTIVE INFRASTRUCTURE SYSTEMS. (A Unified Control Theory Based on the Mikhalevich Methodology)
· Tim Xia · CyberLeninK (CyberLeninka)
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Works count: 23
Citation count: 234
H-index: 9
I10-index: 8
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