Get started
Author

Qing Ji

Observed name: Qing Qing Ji
ORCID: 0000-0002-6896-7504
Observed ORCID: 0000-0002-6896-7504
OpenAlex ID: A5042547650
High specific strength Mg-Li-Zn-Er alloy processed by multi deformation processes
2020 · Qing Ji, Yang Wang, et al. · Materials Characterization · 82
High strength BCC magnesium-Lithium alloy processed by cryogenic rolling and room temperature rolling and its strengthening mechanisms
2022 · Qing Ji, Shun Zhang, et al. · Materials Characterization · 44
Influence alloying elements of Al and Y in Mg Li alloy on the corrosion behavior and wear resistance of microarc oxidation coatings
2021 · Xiaochun Ma, Siyuan Jin, et al. · Surface and Coatings Technology · 44
Effect of Sn alloying and cold rolling on microstructure and mechanical properties of Mg14Li alloy
2021 · Shun Zhang, Xiaochun Ma, et al. · Materials Characterization · 17
The Effect of Y/Er and Zn Addition on the Microstructure and Mechanical Properties of Mg-11Li Alloy
2019 · Mingquan Zhang, Jinghuai Zhang, et al. · Materials · 12
PDF
Effects of non‐isothermal aging process on mechanical properties and corrosion resistance of Al–Mg–Si aluminum alloy
2017 · Yuan Zhu, Qing Qing Ji, et al. · Materials and Corrosion · 9
Epoxy flux technology - Tacky flux with value added benefits
2009 · Bruce Chan, Qing Ji, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 7
High-Strength β-Phase Magnesium–Lithium Alloy Prepared by Multidirectional Rolling
2023 · Zhengyou Guo, Qing Ji, et al. · Materials · 6
PDF
Effects of Al, Y, and Zn Additions on the Microstructure and Mechanical Properties of Mg−3Li Alloy
2022 · Yang Li, Jiahao Wang, et al. · Advanced Engineering Materials · 6
Corrigendum to “Effect of Y and Ce addition on microstructures and Mechanical Properties of LZ91 alloys” [J. Alloy. Comp. 800 (2019) 72-80]
2019 · Qing Ji, Yajun Ma, et al. · Journal of Alloys and Compounds · 4
Underfills for lead-free and low-k flip chip packages
2009 · Qing Ji, Renzhe Zhao, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 4
BCC-Based Mg–Li Alloy with Nano-Precipitated MgZn2 Phase Prepared by Multidirectional Cryogenic Rolling
2022 · Qing Ji, Xiaochun Ma, et al. · Metals · 3
PDF
Solder Fatigue Study through Finite Element Analysis in a Molded Board Level BGA Module
2007 · Jack Zhang, Qing Ji, et al. · 2
Process and Evaluation of High Reliability Reworkable Edge Bond Adhesives for Large Area BGA Applications
2016 · Swapan Bhattacharya, Fei Xie, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 1
Evaluation of Reworkable Edge Bond and Corner Bond Adhesives for BGA Applications
2016 · Fei Xie, Han Wu, et al. · Journal of Surface Mount Technology
Evaluation of High Reliability Reworkable Edge Bond Adhesives for BGA Applications
2015 · Fei Xie, Han Wu, et al. · SMTA International
WLCSP and BGA Reworkable Underfill Evaluation and Reliability
2015 · Fei Xie, Han Wu, et al. · SMTA International
Reworkable Underfill Evaluation for Fine Pitch BGA Applications
2014 · Fei Xie, Han Wu, et al. · SMTA International
Lead Free Application of Flip Chip Underfills
2007 · Renzhe Zhao, Qing Ji, et al. · SMTA International
Works count: 19
Citation count: 241
H-index: 7
I10-index: 5
Year
Topic
Type