Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Myongseob Kim
Institution:
Xilinx (United States)
Observed institutions:
Cornell University,
Xilinx (United States)
OpenAlex ID:
A5043468695
Outstanding and innovative reliability study of 3D TSV interposer and fine pitch solder micro-bumps
2012
·
Bahareh Banijamali
, Suresh Ramalingam
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
49
Enabling a Manufacturable 3D Technologies and Ecosystem using 28nm FPGA with Stack Silicon Interconnect Technology
2013
·
Woon-Seong Kwon
, Myongseob Kim
, et al.
·
IMAPSource Proceedings
·
26
Reliability evaluation of an extreme TSV interposer and interconnects for the 20nm technology CoWoS IC package
2015
·
Bahareh Banijamali
, Tom Lee
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
23
Process and device characteristics of self-assembled metal nano-crystal EEPROM
2000
·
Zengtao Liu
, Myongseob Kim
, et al.
·
Superlattices and Microstructures
·
21
Assembly process qualification and reliability evaluations for heterogeneous 2.5D FPGA with HiCTE Ceramic
2013
·
Ganesh Hariharan
, Raghunandan Chaware
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
15
Performance Improvement for FPGA due to Interposer Metal Insulator Metal Decoupling Capacitors (MIMCAP)
2020
·
Myongseob Kim
, Henley Liu
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
11
Novel electrostatic repulsion forces in MEMS applications by nonvolatile charge injection
2003
·
Zengtao Liu
, Myongseob Kim
, et al.
·
IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
·
8
Actuation by electrostatic repulsion by nonvolatile charge injection
2004
·
Zengtao Liu
, Myongseob Kim
, et al.
·
Sensors and Actuators A Physical
·
7
2.5D FPGA-HBM Integration Challenges
2017
·
Jaspreet Gandhi
, Boon Ang
, et al.
·
IMAPSource Proceedings
·
5
Quality and Reliability of 3D TSV Interposer and Fine Pitch Solder Micro-bumps for 28nm Technology
2011
·
Bahareh Banijamali
, Raghunandan Chaware
, et al.
·
IMAPSource Proceedings
·
5
Fast and sensitive electret polymer characterization by extended floating gate MOSFET
2005
·
Myongseob Kim
, N.Yu.-M. Shen
, et al.
·
IEEE Transactions on Dielectrics and Electrical Insulation
·
5
Low programming voltages and long retention time in metal nanocrystal EEPROM devices
2002
·
Zengtao Liu
, V. Narayanan
, et al.
·
Conference digest
·
4
A New Class of High-Capacity, Resource-Rich Field-Programmable Gate Arrays Enabled by Three- Dimensional Integration Chip-Stacked Silicon Interconnect Technology
2018
·
Suresh Ramalingam
, Henley Liu
, et al.
·
CRC Press eBooks
·
3
3DIC developments for high yield and reliability manufacturing
2017
·
Jonathan Chang
, Henley Liu
, et al.
·
IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
·
3
Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-nm FPGA With Stacked Silicon Interconnect Technology
2015
·
Woon-Seong Kwon
, Myongseob Kim
, et al.
·
Journal of Microelectronics and Electronic Packaging
PDF
A New Technique for Contact Mechanics and Friction in Microstructures: Controllable Electrostatic Repulsive Forces From Capacitive Coupling to Electret
2005
·
Myongseob Kim
, Chungho Lee
, et al.
·
World Tribology Congress (WTC)
Show more works
View as search
Works count:
16
Citation count:
185
H-index:
7
I10-index:
6
Year
Topic
Type
