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Kyongnam Kim
Observed names:
K. N Kim,
Kyong-Nam Kim
Institution:
Daejeon University
Observed institution:
Daejeon University
ORCID:
0000-0002-7225-1330
Observed ORCID:
0000-0002-7225-1330
OpenAlex ID:
A5043600251
Etch Characteristics of SiO2 Using Pulsed Triple-Frequency for Ar/C4F6/O2 Capacitive Coupled Plasmas
2016
·
M. H Jeon
, J. W Park
, et al.
·
Journal of Nanoscience and Nanotechnology
·
13
Cryogenic Etching in Advanced Electronics Manufacturing: Applications and Challenges
2024
·
Kyongnam Kim
·
Applied Science and Convergence Technology
·
12
PDF
Clean SiO 2 atomic layer etching based on physisorption of high boiling point perfluorocarbon
2024
·
Dain Sung
, Hyunwoo Tak
, et al.
·
Nanoscale
·
7
A Study on the Development of Real-Time Chamber Contamination Diagnosis Sensors
2024
·
Junyeob Lee
, Kyongnam Kim
·
Sensors
·
5
PDF
Atomic Layer Etching of SiO2 Utilizing a Radical Generation Module with C4H2F6 Gas
2025
·
Eunchong Kang
, Hongjun Kim
, et al.
·
Applied Science and Convergence Technology
·
1
PDF
Enhanced selective etching of SiON using low-GWP C 3 F 6 as an alternative to CF 4 in low-bias-power inductively coupled plasmas
2026
·
Chen Yang
, Jiachen Wei
, et al.
·
Semiconductor Science and Technology
Atomic Layer Etching Characteristics of SiO 2 Using Reactive Species Controlled from Low-GWP C 4 H 2 F 6 Isomers
2025
·
Jinwoo Choi
, Junyeob Lee
, et al.
·
Journal of Nanoelectronics and Optoelectronics
Development of a Cleaning Endpoint Evaluation Sensor to reliably monitor plasma chamber cleaning
2025
·
Suyoung Jang
, Dohyeon Kim
, et al.
·
Nanotechnology
Author response for "Development of a cleaning endpoint evaluation sensor to reliably monitor plasma chamber cleaning"
2025
·
Suyoung Jang
, Dohyeon Kim
, et al.
·
Publons reviews and discussion
Mechanistic Analysis and Process Characteristics of Si 3 N 4 and SiO 2 Etching Using C 4 H 2 F 6 Isomers
2025
·
Ho June Chang
, Jeongoun Bae
, et al.
·
Journal of Nanoelectronics and Optoelectronics
Atomic Layer Etching of SiO 2 Using C 4 F 6 Remote Radical Source Plasma: Effects of Oxygen-Modified Plasma Chemistry
2025
·
Jin Woo Choi
, Do Hoon Kim
, et al.
·
Journal of Nanoelectronics and Optoelectronics
The Influence of Integration Process on the Imprint in Pt-pzt-pt Ferroelectric Capacitors
1997
·
M H Lee
, Young‐Ha Hwang
, et al.
·
半導体・集積回路技術シンポジウム講演論文集
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Works count:
12
Citation count:
38
H-index:
4
I10-index:
2
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