Author

Kai Xian Lai

Observed names: K. Lai, K. X. Lai, K.X Lai, K.X. Lai, Kai Lai
ORCID: 0009-0008-5320-6682
Observed ORCID: 0009-0008-5320-6682
OpenAlex ID: A5043801274
2010 · K. Lai, B. Phung, et al. · IEEE Transactions on Dielectrics and Electrical Insulation · 58
2024 · Jinsheng Ji, Zhou Shu, et al. · IEEE Transactions on Instrumentation and Measurement · 29
2009 · Nor Asiah Muhamad, B.T. Phung, et al. · Australasian Universities Power Engineering Conference · 27
2009 · K.X. Lai, B.T. Phung, et al. · Australian Journal of Electrical & Electronics Engineering · 21
2023 · Wensong Wang, Yange Wang, et al. · IEEE Transactions on Instrumentation and Measurement · 15
2008 · N.A. Muhamad, B.T. Phung, et al. · International Conference on Condition Monitoring and Diagnosis (CMD) · 15
2007 · K.X. Lai, B.T. Phung, et al. · 15
2024 · Jinsheng Ji, Zhou Shu, et al. · IEEE Transactions on Industrial Informatics · 14
2021 · Kai Xian Lai, Nor Fazlinda Binte Mohd Affandi, et al. · IEEE International Conference on the Properties and Applications of Dielectric Materials (ICPADM) · 10
2024 · Andrea Caprara, Kai Xian Lai, et al. · IEEE Electrical Insulation Magazine · 7
2007 · K.X. Lai, B.T. Phung, et al. · Australasian Universities Power Engineering Conference · 7
2008 · K.X. Lai, A. Lohrasby, et al. · International Symposium on Electrical Insulating Materials (ISEIM) · 6
2009 · Kai Xian Lai, B.T. Phung, et al. · Australasian Universities Power Engineering Conference · 5
2007 · Kai Xian Lai, B.T. Phung, et al. · International Power Engineering Conference · 5
2021 · A. Caprara, G. Ciotti, et al. · IET conference proceedings. · 4
2008 · K.X. Lai, B.T. Phung, et al. · International Conference on Condition Monitoring and Diagnosis (CMD) · 4
2025 · Jinsheng Ji, Wensong Wang, et al. · IEEE Transactions on Instrumentation and Measurement · 3
2024 · Kai Xian Lai, Nor Fazlinda Mohd Affandi, et al. · International Conference on Condition Monitoring and Diagnosis (CMD) · 3
2024 · Kai Xian Lai, Bryan Zhen Yuan Lee, et al. · International Conference on Condition Monitoring and Diagnosis (CMD) · 3
2026 · Hsien Wee Bryan Sim, Sivaneasan Bala Krishnan, et al. · Applied Sciences · 1
2024 · Kai Xian Lai, Bing Hong Leck, et al. · International Conference on Condition Monitoring and Diagnosis (CMD) · 1
2023 · Jinsheng Ji, Zhou Shu, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 1
2026 · Jinsheng Ji, Hongqun Li, et al. · IEEE Transactions on Neural Networks and Learning Systems
Works count: 28
Citation count: 365
H-index: 10
I10-index: 10
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