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Kathrin Reinhardt

The importance of shear thinning, thixotropic and viscoelastic properties of thick film pastes to predict effects on printing performance
2017 · Kathrin Reinhardt, Nancy Hofmann, et al. · European Microelectronics and Packaging Conference · 18
In-situ observations of glass frit related effects during the front side paste contact formation
2014 · Markus Eberstein, Ulrike Schmidt, et al. · Conference record of the IEEE Photovoltaic Specialists Conference · 13
Planar Thermoelectric Microgenerators in Application to Power RFID Tags
2024 · Andrzej Dziedzic, Szymon Wójcik, et al. · Sensors · 7
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Observation of the Contact Formation of PV Frontside Pastes by in-situ Contact Resistance Measurement
2014 · Kathrin Reinhardt, Ulrike Schmidt, et al. · Energy Procedia · 6
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Kinetic Aspects of the Contact Formation by Glass Containing Silver Pastes
2012 · Eberstein, M., Schilm, J., et al. · Fraunhofer-Publica (Fraunhofer-Gesellschaft) · 6
Lead-oxide-free copper thick-film paste for alumina substrates
2010 · Kathrin Reinhardt, Christel Kretzschmar, et al. · International Spring Seminar on Electronics Technology · 4
Development and characterization of a monolithic ceramic pre-package for SiC-semiconductor devices based on LTCC technology
2022 · Christian Lenz, Steffen Ziesche, et al. · Electronic System-Integration Technology Conference (ESTC) · 3
Influence of Oxygen Micro Atmosphere During Contact Formation
2014 · Stefan Körner, Kathrin Reinhardt, et al. · Energy Procedia · 3
High-Performance Structures with Photo-Imageable Pastes for mmWave Applications
2025 · Kathrin Reinhardt, Lynn Ratajczak, et al. · IMAPSource Proceedings · 2
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Reasonable resistor pastes with low TCR using Constantan
2021 · Pascal Sobek, Kathrin Reinhardt, et al. · European Microelectronics and Packaging Conference · 2
A Technological Study Examining the Implementation of Sub-15 μm Finelines using Photoimageable Thick-Film Pastes on Low-Temperature Cofired Ceramics
2025 · Uwe Ziegler, Nesrine Jaziri, et al. · International Spring Seminar on Electronics Technology · 1
Thick-Film CuNi-Ag and CuNi-Cu Thermocouples and Thermoelectric Microgenerators
2024 · Szymon Wójcik, Mirosław Gierczak, et al. · International Spring Seminar on Electronics Technology · 1
Ceramic Embedding of SiC-Semiconductor Using Cofiring Technology
2023 · Steffen Ziesche, Kathrin Reinhardt, et al. · European Microelectronics and Packaging Conference · 1
Glass phase alignment in front side pastes for P- and N-type solar cells
2015 · Markus Eberstein, Kathrin Reinhardt, et al. · China Semiconductor Technology International Conference (CSTIC) · 1
Silver/palladium pastes for aluminium nitride applications
2011 · Reinhardt, K., Kretzschmar, C., et al. · Fraunhofer-Publica (Fraunhofer-Gesellschaft) · 1
Integration of Photo-Imaging Technology and Microvias in LTCC for Enhanced High-Frequency Applications and Packaging
2025 · Birgit Manhica, Martin Ihle, et al. · European Microelectronics and Packaging Conference
Ceramic Embedding of SiC-Semiconductor Using Cofiring Technology
2024 · Steffen Ziesche, Kathrin Reinhardt, et al. · IMAPSource Proceedings
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PrintPOWER - Paste systems for multifunctional copper power modules
2019 · K. Reinhardt, S. Korner, et al. · European Microelectronics and Packaging Conference
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Shrinkage controlled pastes for bulky silver and copper thick films in power electronics
2015 · Richard Schmidt, Kathrin Reinhardt, et al. · IMAPSource Proceedings
Impact of Inorganic Additives on the Performance of front Side Pastes
2013 · Uwe Partsch, Markus Eberstein, et al.
Influence of the organic vehicle and inorganic additives on the properties of thick film pastes for AlN
2013 · Richard Schmidt, Marco Wenzel, et al. · IMAPSource Proceedings
Thermally stable metallizations on polycrystalline diamond films
1995 · S. Liu, Thomas R. Lamp, et al. · OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information)
Works count: 43
Citation count: 73
H-index: 5
I10-index: 2
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