Get started
Author

Wonil Seo

Effect of Cu electroplating parameters on microvoid formation and high-speed shear strength in Sn-3.0Ag-0.5Cu/Cu joints
2017 · Jae-Yong Park, Wonil Seo, et al. · Journal of Alloys and Compounds · 18
Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability
2019 · Wonil Seo, Yong-Ho Ko, et al. · Journal of Materials Science Materials in Electronics · 14
Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints
2019 · Jae-Yong Park, Taeyoung Lee, et al. · Journal of Materials Science Materials in Electronics · 14
Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints
2017 · Wonil Seo, Kyoung-Ho Kim, et al. · Journal of Electronic Materials · 9
PDF
Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG
2014 · Wonil Seo, Kyoung-Ho Kim, et al. · Journal of Electronic Materials · 8
PDF
Growth of intermetallic compounds and brittle fracture behavior of Sn-Ag-Cu/ENIG joint with columnar Ni-P layer
2020 · Wonil Seo, Min-Su Kim, et al. · Journal of Materials Science Materials in Electronics · 6
Effects of Ni-P Bath on the Brittle Fracture of Sn-Ag-Cu Solder/ENEPIG Solder Joint
2017 · Kyoung-Ho Kim, Wonil Seo, et al. · Journal of Welding and Joining · 5
PDF
Effect of electroless Ni plating bath conditions on the impact reliability of Sn-Ag-Cu solder joints
2020 · Wonil Seo · 1
Effects of Flux Activator on Wettability and Slump of Sn-Ag-Cu Solder Paste
2018 · Soon-Yong Kwon, Wonil Seo, et al. · Journal of the Microelectronics and Packaging Society · 1
Solder joint properties of Sn-Ag-Cu solders on environmental-friendly plasma surface finish
2013 · Sang-Hyun Kwon, Kyoung-Ho Kim, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 1
무전해 니켈 도금액 pH 변화에 따른 ENIG/Sn-Ag-Cu솔더 접합부의 취성파괴 특성
2020 · Wonil Seo, Tae Ik Lee, et al.
Brittle Fracture Behavior of ENIG/Sn-Ag-Cu Solder Joint with pH of Ni-P Electroless Plating Solution
2020 · Wonil Seo, Tae‐Ik Lee, et al. · Journal of the Microelectronics and Packaging Society
플럭스 활성제 종류에 따른 Sn-Ag-Cu 솔더 페이스트의 젖음성 및 슬럼프 특성 평가
2018 · 권순용, Wonil Seo, et al.
ENEPIG/Sn-Ag-Cu 솔더 접합부의 취성 파괴에 미치는 무전해 니켈 도금액의 영향
2017 · Kyoung‐Ho Kim, Wonil Seo, et al.
Works count: 14
Citation count: 77
H-index: 6
I10-index: 3
Year
Topic
Type