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Sufyan Tahat

ORCID: 0009-0009-4224-8761
Observed ORCID: 0009-0009-4224-8761
OpenAlex ID: A5044419565
Shear Fatigue Analysis of SAC-Bi Solder Joint Exposed to Varying Stress Cycling Conditions
2023 · Minghong Jian, Sa’d Hamasha, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 36
Risk assessment using the analytic hierarchy process while planning and prior to constructing wind projects in Jordan
2019 · Ammar Alkhalidi, Sufyan Tahat, et al. · Wind Engineering · 27
Effect of temperature on the low cycle fatigue properties of BGA solder joints
2023 · Xin Wei, Ali Alahmer, et al. · Microelectronics Reliability · 24
Listening to the Voice of the Hospitalized Child: Comparing Children’s Experiences to Their Parents
2022 · Haneen Ali, Yasin Fatemi, et al. · Children · 24
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Effects of Multiple Reflows on IMC and Shear Strength of Individual Solder Joints
2023 · Sufyan Tahat, Abdallah Alakayleh, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 15
Effect of Solder Paste Alloy and Volume on Solder Voiding
2023 · Abdallah Alakayleh, Mohamed El Amine Belhadi, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 12
Microstructural Evolution of SAC-Based Solder Joints Exposed to Thermal Cycling: Effect of Paste Alloy, Paste Volume, and Surface Finish
2025 · Abdallah Alakayleh, Sa'd Hamasha, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 5
Aging Effect on Drop-Shock Reliability of SnAgCu305 Solder Alloy
2024 · Saddam Daradkeh, Palash Pranav Vyas, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 3
A Framework to Diagnose the Business and Evaluate Upgrade Plans in SMEs
2021 · Amer Momani, Tarek Al-Hawari, et al. · Management and Production Engineering Review · 2
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Aging Effects on SAC305 Solder Joints: Correlating Intermetallic Compound Evolution, Hardness, and Drop-Shock Performance in ENIG and Immersion Tin Finishes
2026 · Saddam Daradkeh, Abdallah Alakayleh, et al. · Journal of Electronic Packaging · 1
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Microhardness Analysis of Reflowed Solder Joints: Effect of Paste Alloy and Paste Volume
2024 · Abdallah Alakayleh, Sufyan Tahat, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 1
Effect of Temperature and Current Stressing on Low Temperature Solder BGA Drop Performance
2024 · Alyssa Yaeger, Michael Meilunas, et al. · SMTA International
Shear Strength Analysis of Aging SAC-Bi Solder Joints with Different Solder Paste Volumes
2024 · Shaheen Pouya, Ali Alahmer, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
Works count: 13
Citation count: 150
H-index: 6
I10-index: 6
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