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Roland Mumford

Observed name: MUMFORD, ROLAND
Institution: KLA (United States)
ORCID: 0000-0002-5081-1851
Observed ORCID: 0000-0002-5081-1851
OpenAlex ID: A5044723577
A Dry Etch Approach To Reduce Roughness and Eliminate Visible Grind Marks in Silicon Wafers Post Back-Grind
2023 · Roland Mumford, Janet Hopkins, et al. · IEEE Transactions on Semiconductor Manufacturing · 4
Characterization of a UV-USP Laser Grooving Process Combined with Plasma Dicing to Support Next Generation Advanced Packaging Trends
2024 · Rogier Evertsen, Janet Hopkins, et al. · IMAPSource Proceedings · 2
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Novel UV-USP Laser Grooving and Plasma Dicing Separation Schemes for Next Generation Advanced Packaging
2025 · Rogier Evertsen, Simon Dawson, et al. · IEEE Electronics Packaging Technology Conference (EPTC)
Development And Investigation Of A Novel Dry Etch Silicon Smoothing Process
2024 · MUMFORD, ROLAND · Cronfa (Swansea University)
Works count: 4
Citation count: 6
H-index: 2
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