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T. Marangon
Observed names:
T Marangon,
Tina Marangon
Institution:
STMicroelectronics (Italy)
Observed institution:
STMicroelectronics (Italy)
OpenAlex ID:
A5045571591
Novel /spl mu/trench phase-change memory cell for embedded and stand-alone non-volatile memory applications
2004
·
F. Pellizzer
, A. Pirovano
, et al.
·
Symposium on VLSI Technology
·
199
A 90nm Phase Change Memory Technology for Stand-Alone Non-Volatile Memory Applications
2006
·
F. Pellizzer
, A. Benvenuti
, et al.
·
Symposium on VLSI Technology
·
127
Self-aligned μTrench phase-change memory cell architecture for 90nm technology and beyond
2007
·
A. Pirovano
, F. Pellizzer
, et al.
·
European Solid-State Device Research Conference
·
33
Phase-change memory technology with self-aligned μTrench cell architecture for 90nm node and beyond
2008
·
A. Pirovano
, F. Pellizzer
, et al.
·
Solid-State Electronics
·
27
μTrench phase-change memory cell engineering and optimization
2005
·
A. Pirovano
, F. Pellizzer
, et al.
·
European Solid-State Device Research Conference
·
17
Initial reactions in Ti–Si bilayers: New indications from in situ measurements
2001
·
R. Cocchi
, D. Giubertoni
, et al.
·
Journal of Applied Physics
·
15
Self-annealing and aging effect characterization on copper seed thin films
2005
·
G. Brunoldi
, S. Guerrieri
, et al.
·
Microelectronic Engineering
·
10
Investigation of C49–C54 TiSi2 transformation kinetics
2000
·
G Ottaviani
, R Tonini
, et al.
·
Microelectronic Engineering
·
10
Impact of narrow trench geometries on copper film crystallography
2006
·
G. Brunoldi
, K.J. Kozaczek
, et al.
·
Microelectronic Engineering
·
9
Phase formations in Co–Silicon system
2004
·
F. Corni
, R. Tonini
, et al.
·
Microelectronic Engineering
·
7
Decreasing step coverage of self-ionized plasma sputtered copper seed layer with target lifetime
2006
·
S. Guerrieri
, C. Bresolin
, et al.
·
Microelectronic Engineering
·
5
Cobalt Silicide Formation Characteristics in a Single Wafer Rapid Thermal Furnace (SRTF) System
2006
·
Igor J. Malik
, Michel Ouaknine
, et al.
·
International Conference on Advanced Thermal Processing of Semiconductors
·
4
Influence of TiSi2 formation temperature on film thermal stability
2000
·
A Sabbadini
, F Cazzaniga
, et al.
·
Microelectronic Engineering
·
4
Impact of an As implant before CoSi2 formation on the sheet resistance and junction breakdown voltage
2006
·
D. Erbetta
, C.M. Lazzari
, et al.
·
Microelectronic Engineering
·
3
Initial reactions in Ti–Si(Mo) bilayers
2002
·
R Cocchi
, G Ottaviani
, et al.
·
Microelectronic Engineering
·
2
Advanced salicided 4 Mbit flash memory array with borderless contacts
2001
·
D. Peschiaroli
, C. Clementi
, et al.
·
Microelectronic Engineering
·
1
Effects of Ion Metal Plasma (IMP) Titanium Deposition on Ti Silicide Formation
1999
·
A. Sabbadini
, F. Cazzaniga
, et al.
·
MRS Proceedings
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Works count:
17
Citation count:
473
H-index:
9
I10-index:
8
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