Author

Guy Lefranc

Observed names: G. Lefranc, Lefranc, G.

Institution: Siemens (Germany)

Observed institution: Siemens (Germany)

OpenAlex ID: A5045902080

Thermal expansion studies on aluminium-matrix composites with different reinforcement architecture of SiC particles

2006 · T. Huber, H.P. Degischer, et al. · Composites Science and Technology · 174

Localization of electrical-insulation and partial-discharge failures of IGBT modules

2002 · G. Mitic, G. Lefranc · IEEE Transactions on Industry Applications · 92

Improvements in electron microscopy by application of superconductivity

1976 · I. Dietrich, F. Fox, et al. · Ultramicroscopy · 85

Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders

2001 · A. Schubert, H. Walter, et al. · International Symposium on Advanced Packaging Materials · 80

Localisation of electrical-insulation- and partial-discharge failures of IGBT modules

2003 · G. Mitic, G. Lefranc · IEEE Industry Applications Society Annual Meeting (IAS) · 62

Superconducting lens design

1982 · G. Lefranc, E. Knapek, et al. · Ultramicroscopy · 58

IGBT module technology with high partial discharge resistance

2002 · G. Mitic, T. Licht, et al. · IEEE Industry Applications Society Annual Meeting (IAS) · 50

Reliability of AlN substrates and their solder joints in IGBT power modules

1999 · G. Mitic, R. Beinert, et al. · Microelectronics Reliability · 42

High temperature reliability on automotive power modules verified by power cycling tests up to 150°C

2003 · G. Coquery, G. Lefranc, et al. · Microelectronics Reliability · 39

Effect of copper additions to superconducting niobium-tin sinter materia

1976 · G. Lefranc, A. Müller · Journal of the Less Common Metals · 39

Reliability testing of high-power multi-chip IGBT modules

2000 · G. Lefranc, T. Licht, et al. · Microelectronics Reliability · 30

Electron microscopical results on cryoprotection of organic materials obtained with cold stages

1982 · E. Knapek, G. Lefranc, et al. · Ultramicroscopy · 21

Aluminum bond-wire properties after 1 billion mechanical cycles

2003 · G. Lefranc, B. Weiss, et al. · Microelectronics Reliability · 18

Properties of solders and their fatigue in power modules

2002 · G. Lefranc, G. Mitic, et al. · Microelectronics Reliability · 18

Reliable power electronics for automotive applications

2002 · N. Seliger, E. Wolfgang, et al. · Microelectronics Reliability · 16

The interpretation of radiation damage measurements with electron diffraction of organic materials at very low temperatures

1984 · E. Knapek, H. Formanek, et al. · Ultramicroscopy · 16

AlSiC composite materials in IGBT power modules

2002 · G. Mitic, H.P. Degischer, et al. · IEEE Industry Applications Society Annual Meeting (IAS) · 13

A solder bumping interconnect technology for high-power devices

2004 · K. Hase, G. Lefranc, et al. · IEEE Power Electronics Specialists Conference (PESC) · 12

The thermal impedance of new power semiconductor modules using AlN substrates

2002 · G. Mitic, K.-H. Sommer, et al. · IEEE Industry Applications Society Annual Meeting (IAS) · 11

Abschirmverhalten von Niob-Zinn-Sintermaterial bei zugabe von fremdelementen

1972 · I. Dietrich, G. Lefranc, et al. · Journal of the Less Common Metals · 11

Design and fabrication of synthetic lenses in silicon

1993 · Albert Stemmer, Helmut Zarschizky, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 8

A self-aligned GaAs MESFET process with WSi gates for analog and digital applications

1991 · T. Grave, J. Willer, et al. · Solid-State Electronics · 7

A superconducting lens system operated in the fixed-beam and the scanning mode

1981 · G. Lefranc, K.-H. Müller, et al. · Ultramicroscopy · 7

Non‐destructive Investigation of AlSi7Mg/SiC70p MMCs by means of Acoustic Scanning Microscopy, X‐Ray and Neutron Diffraction

2003 · U. Göbel, G. Lefranc, et al. · Materialwissenschaft und Werkstofftechnik · 6

High efficiency diffractive coupling lenses by three-dimensional profiling with electron-beam lithography and reactive ion etching

1994 · A. Stemmer, H. Zarschizky, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 5

Works count: 45

Citation count: 951

H-index: 16

I10-index: 20