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Author

Houfu Dai

Institution: Shantou University
ORCID: 0000-0002-8914-614X
Observed ORCIDs: 0000-0002-8914-614X, 0000-0002-8343-7827
OpenAlex ID: A5046506870
Recent advances in focused ion beam nanofabrication for nanostructures and devices: fundamentals and applications
2020 · Ping Li, Siyu Chen, et al. · Nanoscale · 314
A numerical study of ultraprecision machining of monocrystalline silicon with laser nano-structured diamond tools by atomistic simulation
2016 · Houfu Dai, Genyu Chen, et al. · Applied Surface Science · 115
Numerical simulation of materials-oriented ultra-precision diamond cutting: review and outlook
2023 · Liang Zhao, Junjie Zhang, et al. · International Journal of Extreme Manufacturing · 99
Effects of local strain rate and temperature on the workpiece subsurface damage in grinding of optical glass
2020 · Ping Li, Siyu Chen, et al. · International Journal of Mechanical Sciences · 87
A study of ultraprecision mechanical polishing of single-crystal silicon with laser nano-structured diamond abrasive by molecular dynamics simulation
2019 · Houfu Dai, Fa Zhang, et al. · International Journal of Mechanical Sciences · 84
Comparison of subsurface damages on mono-crystalline silicon between traditional nanoscale machining and laser-assisted nanoscale machining via molecular dynamics simulation
2017 · Houfu Dai, Shaobo Li, et al. · Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms · 72
The effect of tool geometry on subsurface damage and material removal in nanometric cutting single-crystal silicon by a molecular dynamics simulation
2016 · Houfu Dai, Genyu Chen, et al. · Applied Physics A · 68
Molecular dynamics simulation of ultra-precision machining 3C-SiC assisted by ion implantation
2021 · Houfu Dai, Yang Hu, et al. · Journal of Manufacturing Processes · 58
Atomic simulation of textured silicon carbide surface ultra-precision polishing
2022 · Xiaosong Meng, Weilong Wu, et al. · Ceramics International · 55
Effects of wheel speed on surface/subsurface damage characteristics in grinding of glass-ceramics
2020 · Ping Li, Tan Jin, et al. · Ceramics International · 46
Influence of laser nanostructured diamond tools on the cutting behavior of silicon by molecular dynamics simulation
2017 · Houfu Dai, Genyu Chen, et al. · RSC Advances · 46
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Topographical characterization and wear behavior of diamond wheel at different processing stages in grinding of N-BK7 optical glass
2020 · Ping Li, Tan Jin, et al. · Tribology International · 45
Molecular dynamics simulation of subsurface damage mechanism during nanoscratching of single crystal silicon
2018 · Houfu Dai, Shaobo Li, et al. · Proceedings of the Institution of Mechanical Engineers Part J Journal of Engineering Tribology · 44
Molecular dynamics simulation of ion-implanted single-crystal 3C-SiC nano-indentation
2022 · Weilong Wu, Yang Hu, et al. · Journal of Manufacturing Processes · 43
A numerical study on subsurface quality and material removal during ultrasonic vibration assisted cutting of monocrystalline silicon by molecular dynamics simulation
2019 · Houfu Dai, Jingjing Chen, et al. · Materials Research Express · 43
Quantitative analysis of grinding performance of cubic silicon carbide surface texture lubricated with water film
2023 · Zezheng Ou, Weilong Wu, et al. · Tribology International · 41
Machining behaviors of glass-ceramics in multi-step high-speed grinding: Grinding parameter effects and optimization
2020 · Ping Li, Siyu Chen, et al. · Ceramics International · 41
Influence of elliptical vibration on the behavior of silicon during nanocutting
2019 · Houfu Dai, Hao Du, et al. · The International Journal of Advanced Manufacturing Technology · 41
Numerical study of three-body diamond abrasive polishing single crystal Si under graphene lubrication by molecular dynamics simulation
2019 · Houfu Dai, Fa Zhang, et al. · Computational Materials Science · 40
In-situ preparation of superhydrophobic Zn-Al layered double hydroxide coatings for corrosion protection of aluminum alloy
2022 · Qiao Zeng, Xuehong Min, et al. · Materials Letters · 32
Molecular dynamics study on grinding mechanism of polycrystalline silicon carbide
2022 · Minghao Chen, Houfu Dai · Diamond and Related Materials · 31
Atomistic simulation of influence of laser nano-structured diamond abrasive on the polishing behavior of silicon
2019 · Houfu Dai, Yuqi Zhou, et al. · Materials Science in Semiconductor Processing · 30
A molecular dynamics investigation into the mechanisms of material removal and subsurface damage of nanoscale high speed laser-assisted machining
2016 · Houfu Dai, Genyu Chen · Molecular Simulation · 30
The Removal Mechanism of Monocrystalline Si in the Process of Double Diamond Abrasive Polishing by Molecular Dynamics Simulation
2021 · Houfu Dai, Haixia Yue, et al. · Tribology Letters · 29
Atomistic simulation on the removal mechanism of monocrystal silicon carbide with textured surface nano-machining in water lubrication
2023 · Houfu Dai, Weilong Wu, et al. · Journal of Manufacturing Processes · 28
Works count: 47
Citation count: 1,772
H-index: 26
I10-index: 34
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