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Nasser Razek
Observed names:
N. Razek,
Razek Nasser,
Razek, Nasser
Observed institutions:
EV Group (Austria),
Leibniz Institute of Surface Engineering
OpenAlex ID:
A5047027071
III–V-on-silicon solar cells reaching 33% photoconversion efficiency in two-terminal configuration
2018
·
Romain Cariou
, Jan Benick
, et al.
·
Nature Energy
·
350
Monolithic Two-Terminal III–V//Si Triple-Junction Solar Cells With 30.2% Efficiency Under 1-Sun AM1.5g
2016
·
Romain Cariou
, Jan Benick
, et al.
·
IEEE Journal of Photovoltaics
·
122
GaAs surface cleaning by low energy hydrogen ion beam treatment
2002
·
N. Razek
, K. Otte
, et al.
·
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films
·
33
Novel Surface Preparation Methods for Covalent and Conductive Bonded Interfaces Fabrication
2014
·
Christoph Flötgen
, Nasser Razek
, et al.
·
ECS Transactions
·
15
PDF
Ultra-high vacuum direct bonding of a p–n junction GaAs wafer using low-energy hydrogen ion beam surface cleaning
2006
·
N. Razek
, A. Schindler
, et al.
·
Vacuum
·
15
GaAs surface cleaning by low-energy hydrogen ion bombardment at moderate temperatures
2004
·
E. Schubert
, N. Razek
, et al.
·
Journal of Applied Physics
·
14
Combined surface-focused acoustic microscopy in transmission and scanning ultrasonic holography
2006
·
Evgeny Twerdowski
, Moritz von Buttlar
, et al.
·
Ultrasonics
·
10
Author Correction: III–V-on-silicon solar cells reaching 33% photoconversion efficiency in two-terminal configuration
2018
·
Romain Cariou
, Jan Benick
, et al.
·
Nature Energy
·
9
PDF
Direct Wafer Bonding of GaN for Power Devices Applications
2018
·
Viorel Dragoi
, Nasser Razek
, et al.
·
ECS Transactions
·
8
Conductive Semiconductor Interfaces Fabricated by Room Temperature Covalent Wafer Bonding
2016
·
Christoph Flötgen
, Nasser Razek
, et al.
·
ECS Transactions
·
8
PDF
Application of spatially and temporally apodized non-confocal acoustic transmission microscopy to imaging of directly bonded wafers
2005
·
Evgeny Twerdowski
, Reinhold Wannemacher
, et al.
·
Ultrasonics
·
7
Si-Ge Heterostructures Fabricated by Room Temperature Wafer Bonding
2018
·
Nasser Razek
, Viorel Dragoi
, et al.
·
ECS Transactions
·
5
PDF
Low temperature covalent wafer bonding for X-ray imaging detectors
2019
·
Nasser Razek
, Jorge Neves
, et al.
·
Japanese Journal of Applied Physics
·
3
PDF
Low temperature wafer bonding for wafer-level 3D integration
2014
·
V. Dragoi
, B. Rebhan
, et al.
·
International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
·
3
Author Correction: III–V-on-silicon solar cells reaching 33% photoconversion efficiency in two-terminal configuration
2018
·
Romain Cariou
, Jan Benick
, et al.
·
Nature Energy
·
2
PDF
Room-temperature ultrahigh vacuum bonding of Ge∕GaAs p-n heterojunction wafer using 300eV hydrogen ion beam surface cleaning
2007
·
N. Razek
, A. Schindler
·
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films
·
2
Wafer Bonding
2020
·
Bernhard Rebhan
, Viorel Dragoi
, et al.
·
Wiley eBooks
·
1
Direct Wafer Bonding of GaN for Power Devices Applications
2018
·
Viorel Dragoi
, Nasser Razek
, et al.
·
ECS Meeting Abstracts
·
1
Conductive Semiconductor Interfaces Fabricated by Room Temperature Covalent Wafer Bonding
2016
·
Christoph Flötgen
, Nasser Razek
, et al.
·
ECS Meeting Abstracts
·
1
Novel Surface Preparation Methods for Covalent and Conductive Bonded Interfaces Fabrication
2014
·
Christoph Flötgen
, Nasser Razek
, et al.
·
ECS Meeting Abstracts
·
1
NDT of wafer direct bonding by non-confocal transmission phase sensitive acoustic microscopy
2005
·
Evgeny Twerdowski
, Reinhold Wannemacher
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
1
Stability of Interface Morphology and Thermal Boundary Conductance of Direct Wafer Bonded GaN|Si Heterojunction Interfaces Annealed at Growth and Annealing Temperatures
2023
·
Kenny Huynh
, Michael Evan Liao
, et al.
·
ECS Meeting Abstracts
A GaAs/Si X-Ray Pixel Detector Based on Low Temperature Covalent Wafer Bonding
2020
·
Nasser Razek
, Ivan Prieto
, et al.
·
ECS Meeting Abstracts
Low Thermal Boundary Resistance in Direct Wafer Bonded GaN|Si Hetereojunction Interfaces
2020
·
Kenny Huynh
, Michael Evan Liao
, et al.
·
ECS Meeting Abstracts
Low temperature covalent wafer bonding for X-ray imaging detectors
2019
·
Nasser Razek
, Jorge Neves
, et al.
·
International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
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Works count:
34
Citation count:
611
H-index:
8
I10-index:
7
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