Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Shivangi Chandrakar
Observed name:
Dr. Shivangi Chandrakar
Institution:
Chhattisgarh Swami Vivekanand Technical University
Observed institutions:
Chhattisgarh Swami Vivekanand Technical University,
International Institute of Information Technology
ORCID:
0000-0002-3744-6917
Observed ORCID:
0000-0002-3744-6917
OpenAlex ID:
A5047199990
Performance analysis of Cu/CNT-based TSV: impact on crosstalk and power
2022
·
Shivangi Chandrakar
, Deepika Gupta
, et al.
·
Journal of Computational Electronics
·
19
PDF
Role of Through Silicon Via in 3D Integration: Impact on Delay and Power
2020
·
Shivangi Chandrakar
, Deepika Gupta
, et al.
·
Journal of Circuits Systems and Computers
·
19
Reliability Concerns of TSV-Based 3-D Integration: Impact of Interfacial Crack
2023
·
Vandana Kumari
, Shivangi Chandrakar
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
16
Electrical Modeling and Performance Analysis of Cu and CNT Based TSV-Bump-RDL
2024
·
Shivangi Chandrakar
, Kamal Solanki
, et al.
·
IEEE Transactions on Nanotechnology
·
11
Performance Analysis of Bump in Tapered TSV: Impact on Crosstalk and Power Loss
2022
·
Shivangi Chandrakar
, Deepika Gupta
, et al.
·
IEEE Open Journal of Nanotechnology
·
11
Signal Transmission and Reflection Losses of Cylindrical and Tapered shaped TSV in 3D Integrated Circuits
2020
·
Chopali Chanchal Sahu
, Shivangi Chandrakar
, et al.
·
IEEE International Symposium on Smart Electronic Systems (iSES)
·
9
Impact of TSV bump and redistribution layer on crosstalk delay and power loss
2023
·
Shivangi Chandrakar
, Deepika Gupta
, et al.
·
Memories - Materials Devices Circuits and Systems
·
8
High-Frequency Electromagnetic Eddy Effect Modeling for Cylindrical and Tapered Bump
2023
·
Shivangi Chandrakar
, Deepika Gupta
, et al.
·
IEEE Transactions on Electromagnetic Compatibility
·
4
Performance and reliability analysis of redistribution layers under interfacial crack
2025
·
Vandana Kumari
, Shivangi Chandrakar
, et al.
·
Microelectronics Reliability
·
3
PDF
Crosstalk and Power Analysis in Tapered based Composite Cu-CNT TSV in 3D IC
2024
·
Shivangi Chandrakar
, Deepika Gupta
, et al.
·
IEEE International Symposium on Circuits and Systems proceedings
·
3
Signal Integrity and Power Loss Analysis for Different Bump Structures in Cylindrical TSV
2022
·
Shivangi Chandrakar
, Kunal Kranti Das
, et al.
·
Communications in computer and information science
·
2
Hybrid Cu-CNT Composite as Interconnect Materials and Their Equivalent Models
2023
·
Shivangi Chandrakar
, Manoj Kumar Majumder
·
CRC Press eBooks
·
1
Electrical fault modelling and power-performance analysis of TSV solder bump defects
2026
·
Jagruti Rishi Sahu
, Shivangi Chandrakar
, et al.
·
Microelectronics Reliability
A Survey on Emotion Detection Using Audio Data Processing and Deep Learning
2025
·
Rahul Sahu
, Dr. Shivangi Chandrakar
, et al.
·
International Journal of Engineering Applied Sciences and Technology
PDF
Show more works
View as search
Works count:
14
Citation count:
106
H-index:
7
I10-index:
5
Year
Topic
Type
