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Yihua Liu
Observed name:
Y. Liu
Institution:
Lam Research (United States)
Observed institutions:
National Institute of Standards and Technology,
Lam Research (United States),
Material Measurement Laboratory
ORCID:
0000-0002-8282-8906
Observed ORCID:
0000-0002-8282-8906
OpenAlex ID:
A5047781226
Superconformal Copper Electroplating on an Ultrathin Cobalt Seed in an Acidic Copper Sulfate Electrolyte
2022
·
Y. Liu
, L. J. Brogan
, et al.
·
Journal of The Electrochemical Society
·
4
PDF
Improved Copper Damascene Wires Using Direct Plate on Cobalt Process
2019
·
Lee J Brogan
, Yihua Liu
, et al.
·
ECS Meeting Abstracts
·
3
Dealloyed Pt74Ni26 and Pt26Ni74 Electrodeposited Thin Film Electrocatalysts for Oxygen Reduction
2024
·
C. M. Hangarter
, E. D. Rus
, et al.
·
Journal of The Electrochemical Society
·
2
Impact of uncompensated resistance on Hads-terminated Pt electrodeposition
2024
·
Y. Liu
, M. Lafouresse
, et al.
·
Journal of Solid State Electrochemistry
·
1
Metallization of Advanced Interconnects by Cu Electroplating in Alkaline Media
2026
·
Yihua Liu
, Matthew M. Huie
, et al.
·
ECS Meeting Abstracts
Nucleation and Growth of Copper on Cobalt in Advanced Interconnect Metallization
2022
·
Yihua Liu
, Lee Brogan
, et al.
·
ECS Meeting Abstracts
(Invited) Investigations into the Role of Adsorption Processes in Alloy Deposition
2022
·
Thomas P Moffat
, Yihua Liu
, et al.
·
ECS Meeting Abstracts
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Works count:
7
Citation count:
10
H-index:
2
I10-index:
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