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Ricardo Cotrin Teixeira

Observed names: R. C. Teixeira, R. Cotrin Teixeira, R.C. Teixeira, Ricardo C. Teixeira, Ricardo Cotrim Teixeira, Ricardo Teixeira, Teixeira, R.C., Teixeira, Ricardo Cotrin, Teixeira, Ricardo Cotrin
ORCID: 0000-0002-5443-2605
Observed ORCID: 0000-0002-5443-2605
OpenAlex ID: A5048092157
3D stacked IC demonstration using a through Silicon Via First approach
2008 · J. Van Olmen, A. Mercha, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 138
Micro-Raman stress characterization of polycrystalline silicon films grown at high temperature
2004 · R.C. Teixeira, I. Doi, et al. · Materials Science and Engineering B · 53
Process induced sub-surface damage in mechanically ground silicon wafers
2008 · Yu Yang, Koen De Munck, et al. · Semiconductor Science and Technology · 39
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3D Embedding and Interconnection of Ultra Thin (≪ 20 μm) Silicon Dies
2007 · F. Iker, D.S. Tezcan, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 20
Stress Analysis on Ultra Thin Ground Wafers
2020 · Ricardo C. Teixeira, Koen De Munck, et al. · Journal of Integrated Circuits and Systems · 15
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TSV metrology and inspection challenges
2009 · Ramakanth Alapati, Youssef Travaly, et al. · IEEE International Conference on 3D System Integration (3DIC) · 10
Investigation of the stability of metallic grids for large-area perovskite solar cells
2024 · José Maria C. da Silva Filho, Andreia de Morais, et al. · Solar Energy Materials and Solar Cells · 9
Boosting the Ionizing Radiation Tolerance in the Mosfets Matching by Using Diamond Layout Style
2019 · Vinicius Vono Peruzzi, William Souza da Cruz, et al. · Symposium on Microelectronics Technology and Devices · 9
Thermal stability of Ni(Pt) silicide films formed on poly-Si
2005 · I. Doi, R.C. Teixeira, et al. · Microelectronic Engineering · 9
Non-Functionalized Graphene Ribbons FET Biosensor Platform: SARS-CoV-2 Detection on TiO2Gate Dielectric Windows
2024 · Fernando Cesar Rufino, Cassio Roberto de Almeida, et al. · IEEE Sensors Journal · 8
Statistical Analysis of the Influence of Thinning Processes on the Strength of Silicon
2008 · Yu Yang, Ricardo Cotrin Teixeira, et al. · MRS Proceedings · 8
Electroless Ni–P plating deposited simultaneously on both surface sides of a flexible indium tin oxide coated polyethylene terephthalate substrate
2024 · Andreia de Morais, Alexander Flacker, et al. · Journal of Materials Science Materials in Electronics · 7
Impact of thinning and packaging on a deep submicron CMOS product
2009 · Daniel Perry, U. C. Ray, et al. · 7
Multi-Chip Module (MCM-D) using thin film technology
2014 · Cristina B. Adamo, Alexander Flacker, et al. · Symposium on Microelectronics Technology and Devices · 6
Diamond bit cutting as alternative to polymer patterning for 3D interconnections technologies
2009 · F. Iker, T. Funaya, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
Thickness Characterization of Ultra Thin Wafers on Carrier
2007 · R. C. Teixeira, K. De Munck, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 6
Sensor detection of shelf life: a multi-technique food analytical platform for mushroom analysis
2025 · Patricia Yukari Saiki, Fernando Cesar Rufino, et al. · Food Research International · 5
Deposition of sacrificial silicon oxide layers by electron cyclotron resonance plasma
2007 · C. Biasotto, A. M. Daltrini, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 5
Multi-Chip Module (MCM-D) Using Thin Film Technology
2020 · Cristina B. Adamo, Alexander Flacker, et al. · Journal of Integrated Circuits and Systems · 4
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A 4 mm toroidal microtransformer built with wire bonding and MCM technologies
2019 · Fellype do Nascimento, Antonio C. C. Telles, et al. · Symposium on Microelectronics Technology and Devices · 4
Alternative technological development for RF hybridization
2017 · Célio Antônio Finardi, André da Fontoura Ponchet, et al. · Materials Research Express · 4
Stress Analysis on Ultra Thin Ground Wafers
2007 · R. C. Teixeira, K. De Munck, et al. · ECS Transactions · 4
Hb Camperdown [α2β2104(G6)ARG → SER] Identified by DNA Analysis in a Brazilian Family
1996 · S. R. P. Miranda, E. M. Kimura, et al. · Hemoglobin · 4
Morphology Behavior of Copper Films Deposited after Wet Surface Treatment on Polished Alumina
2022 · Alexander Flacker, Gabriela Gomes, et al. · Journal of the Brazilian Chemical Society · 3
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Development of microtransformers using MCM and electronic packaging technologies
2017 · M. M. Rocha, A. C. C. Telles, et al. · Symposium on Integrated Circuits and Systems Design · 3
Works count: 55
Citation count: 413
H-index: 9
I10-index: 6
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