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Laurent Gaëtan Michaud

Study and Control of the Distortion Induced by the Bonding Process for BSPDN Approaches
2024 · Karine Abadie, Ivanie Mendes, et al. · IEEE International Interconnect Technology Conference (IITC) · 9
Large Scale Integration of Functional Radio‐Frequency Flexible MEMS under Large Mechanical Strain
2022 · Edy Azrak, Laurent Michaud, et al. · Advanced Functional Materials · 9
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Flexible piezoelectric transducers based on a PMMA/ZnO nanowire composite
2017 · R. Tao, G. Ardila, et al. · Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon · 9
Edge Bonding Voids Management Using Humid Helium Bonding Atmosphere
2023 · Frank Fournel, Vincent Larrey, et al. · ECS Transactions · 5
Elaboration and characterization of a 200 mm stretchable and flexible ultra-thin semi-conductor film
2019 · L G Michaud, C Castan, et al. · Nanotechnology · 5
Surface activated Cu/SiO2 hybrid bonding for room temperature 3D integration
2025 · K. Abadie, P. Renaud, et al. · Japanese Journal of Applied Physics · 4
Modulation of post-fracture roughness with induced shear stress in the smart cut process
2024 · Lucas Colonel, Q. Lomonaco, et al. · Journal of Applied Physics · 4
Inline Bondwave Monitoring for Direct Bonding, Process Optimization and Impact on Post-Bond Distortion
2023 · Laurent Gaëtan Michaud, Frank Fournel, et al. · ECS Transactions · 4
Transfer of an ultrathin single-crystal silicon film from a silicon-on-insulator to a polymer
2020 · L.G. Michaud, E. Azrak, et al. · Materials Today Nano · 4
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Aluminium-Nitride Thin-Films On Polymer Substrates Obtained by Adhesive Bonding
2021 · Edy Azrak, Laurent G. Michaud, et al. · ECS Journal of Solid State Science and Technology · 3
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TEOS and thermal oxide low temperature direct wafer bonding dynamics
2025 · L. G. Michaud, K. Abadie, et al. · Japanese Journal of Applied Physics · 2
Vacuum Quality Impact on Covalent Bonding
2023 · Karine Abadie, Quentin Lomonaco, et al. · ECS Transactions · 2
Stress Engineering in Germanium-Silicon Heterostructure Using Surface Activated Hot Bonding
2022 · Quentin Lomonaco, Karine Abadie, et al. · ECS Transactions · 2
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TEOS and Thermal Oxide Low Temperature Direct Wafer Bonding Dynamics
2024 · L.G. Michaud, K. Abadie, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) · 1
Surface Activated Cu/SiO2 Hybrid Bonding for Room Temperature 3D Integration
2024 · K. Abadie, P. Renaud, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) · 1
(First Best Paper Award) Vacuum Quality Impact on Covalent Bonding
2023 · Karine Abadie, Quentin Lomonaco, et al. · ECS Meeting Abstracts · 1
Inline Bondwave Monitoring for Direct Bonding, Process Optimization and Impact on Post-Bond Distortion
2023 · Laurent Gaëtan Michaud, Frank Fournel, et al. · ECS Meeting Abstracts · 1
Exploration and mitigation of local wafer deformations resulting from direct wafer-to-wafer bonding
2026 · Richard van Haren, Suwen Li, et al. · SPIE Novel Patterning Technologies
Edge Bonding Voids Management Using Humid Helium Bonding Atmosphere
2023 · Frank Fournel, Vincent Larrey, et al. · ECS Meeting Abstracts
Stress Engineering in Germanium-Silicon Heterostructure Using Surface Activated Hot Bonding
2022 · Quentin Lomonaco, Karine Abadie, et al. · ECS Meeting Abstracts
Elaboration and transfer of tensile strained thin films
2021 · Laurent Michaud · theses.fr (ABES)
Highly Strained Silicon on Polymer Obtained By Temporary Polymer Wafer Bonding
2020 · Laurent Gaëtan Michaud, Clément Castan, et al. · ECS Meeting Abstracts
Works count: 23
Citation count: 66
H-index: 5
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