Author

Yves Leduc

Observed names: Leduc Yves, Leduc, Y., Y. Leduc, Yves LEDUC
OpenAlex ID: A5048605987
1999 · Christian D. Hedayat, Ahmed Hachem, et al. · Analog Integrated Circuits and Signal Processing · 41
2016 · Hassan Jouni, Mariam Issa, et al. · IEEE International Multidisciplinary Conference on Engineering Technology (IMCET) · 30
1977 · P.G.A. Jespers, C. Jusseret, et al. · IEEE Journal of Solid-State Circuits · 16
2019 · Zhaopeng Wei, Gilles Jacquemod, et al. · Active and Passive Electronic Components · 11
2016 · Zhaopeng Wei, Gilles Jacquemod, et al. · Journal of Low Power Electronics · 8
2011 · Yannick Vaiarello, William Tatinian, et al. · IEEE Journal on Emerging and Selected Topics in Circuits and Systems · 8
1992 · L. Le Toumelin, P. Carbou, et al. · IEEE Journal of Solid-State Circuits · 7
2019 · Hassan Jouni, Adnan Harb, et al. · SN Applied Sciences · 6
2017 · Zhaopeng Wei, Yves Leduc, et al. · IEEE International New Circuits and Systems Conference (NEWCAS) · 4
2014 · Alexandre Fonseca, Gilles Jacquemod, et al. · IEEE International New Circuits and Systems Conference (NEWCAS) · 4
2024 · Yuqing Mao, Yoann Charlon, et al. · Journal of Low Power Electronics and Applications · 3
2019 · Melanie MOIGN, Jean-Pierre LECA, et al. · Conference on Ph.D. Research in Microelectronics and Electronics · 3
2017 · Hassan Jouni, Adnan Harb, et al. · 3
2016 · Gilles Jacquemod, Zhaopeng Wei, et al. · European Workshop on Microelectronics Education (EWME) · 3
2002 · L. Le Toumelin, P. Carbou, et al. · Custom Integrated Circuits Conference · 3
1979 · G. Grassl, Y. Leduc, et al. · IEEE Transactions on Electron Devices · 3
2019 · G. Jacquemod, Z. Wei, et al. · IFIP/IEEE International Conference on Very Large Scale Integration · 2
2018 · Hassan Jouni, Adnan Harb, et al. · International Conference on Computer and Applications (ICCA) · 2
2016 · Zhaopeng Wei, Yves Leduc, et al. · IEEE International Conference on Electronics, Circuits and Systems (ICECS) · 2
2024 · Yuqing Mao, Yoann Charlon, et al. · Journal of Low Power Electronics and Applications · 1
2022 · Mélanie Moign, Gilles Jacquemod, et al. · IEEE Electromagnetic Compatibility Magazine · 1
2019 · Moign Melanie, Leca Jean-Pierre, et al. · International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) · 1
2015 · Gilles Jacquemod, Zhaopeng Wei, et al. · 1
2015 · Gilles Jacquemod, Alexandre Fonseca, et al. · Frontiers of Materials Science · 1
2014 · Miguel A. Garcia Perez, Yves Leduc, et al. · European Embedded Design in Education and Research Conference (EDERC) · 1
Works count: 42
Citation count: 167
H-index: 7
I10-index: 4
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