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Author

Yang‐En Wu

Observed name: Yang-En Wu
ORCID: 0009-0003-9235-5254
Observed ORCID: 0009-0003-9235-5254
OpenAlex ID: A5049229639
41‐1: Invited Paper: Active Matrix Mini‐LED Backlights for 1000PPI VR LCD
2019 · Yang-En Wu, Ming-Hsien Lee, et al. · SID Symposium Digest of Technical Papers · 23
Current Landscape of Micro-LED Display Industrialization
2025 · Yang-En Wu, Chia-Hung Tsai, et al. · Nanomaterials · 13
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17‐1:Invited Paper:An Overview of Solutions for Achieving HDR LCDs
2020 · Jenn-Jia Su, Hsueh-Ying Huang, et al. · SID Symposium Digest of Technical Papers · 7
39-1: Mutual-Capacitance in-Cell Touch Panel
2016 · Chen-Hao Chiang, Yang-En Wu, et al. · SID Symposium Digest of Technical Papers · 7
Digital Mini-LED Lighting Using Organic Thin-Film Transistors Reaching over 100,000 Nits of Luminance
2025 · Chia-Hung Tsai, Yang-En Wu, et al. · Nanomaterials · 6
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Exploring Light Stability and Trapping Mechanisms in Organic Thin-Film Transistors for High-Brightness MicroLED Integration
2024 · Chia-Hung Tsai, Yang-En Wu, et al. · Materials · 5
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P‐11: Integrated Gate Driver Circuit with One Conduction Path for Charge‐Discharge
2006 · Shih‐Hsun Lo, Chun‐Ching Wei, et al. · SID Symposium Digest of Technical Papers · 5
15.1: Invited Paper: A 46‐inch TFT‐LCD HDTV Technology with Color Management and Image Quality Enhancement
2004 · C. T. Liu, Yu Chieh Lin, et al. · SID Symposium Digest of Technical Papers · 5
Enhanced micro‐LED light efficiency by optical structures on substrate
2025 · Yang‐En Wu, Jia‐Hao Hsu, et al. · Journal of the Society for Information Display · 4
Photolithography-compatible integration of organic thin-film transistors via solvent-free dry patterning for scalable AMOLED fabrication
2026 · Chia-Hung Tsai, Yu-Hsin Lin, et al. · Materials Advances · 1
52‐4: Micro LED Display Light Extraction Efficiency Improvement by Secondary Optics on Substrate
2024 · Yang-En Wu, Jia-Hao Hsu, et al. · SID Symposium Digest of Technical Papers · 1
16‐3: Recent Progress in Low‐Resistance Gate Metal of LTPS TFT Devices
2026 · Jia-Hong Ye, Ching-Liang Huang, et al. · SID Symposium Digest of Technical Papers
55‐1: Integrated Through Glass Via (TGV) Technology for Advanced Co‐Packaged Optics (CPO) Development
2026 · Jia-Hong Ye, Ching-Liang Huang, et al. · SID Symposium Digest of Technical Papers
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Works count: 13
Citation count: 77
H-index: 5
I10-index: 2
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