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Nilesh U. Badwe

Observed names: N. Badwe, Nilesh Badwe
ORCID: 0000-0001-6179-7736
Observed ORCID: 0000-0001-6179-7736
OpenAlex ID: A5049302405
Mechanical properties of nanoporous gold in tension
2017 · Nilesh Badwe, Xiying Chen, et al. · Acta Materialia · 151
Potential-dependent dynamic fracture of nanoporous gold
2015 · Shaofeng Sun, Xiying Chen, et al. · Nature Materials · 100
Decoupling the role of stress and corrosion in the intergranular cracking of noble-metal alloys
2018 · N. Badwe, X. Chen, et al. · Nature Materials · 95
Low Temperature Solder - A Breakthrough Technology for Surface Mounted Devices
2018 · Shubhada Sahasrabudhe, Scott Mokler, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 55
Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects
2021 · Yaohui Fan, Yifan Wu, et al. · Journal of Electronic Materials · 21
Dynamic fracture and dealloying induced stress-corrosion cracking
2021 · Xiying Chen, Erin Karasz, et al. · Corrosion Science · 21
Interfacial fracture strength and toughness of copper/epoxy-resin interfaces
2015 · Nilesh Badwe, Ravi Mahajan, et al. · Acta Materialia · 16
Low Temperature Lead‐Free Alloys and Solder Pastes
2020 · Raiyo Aspandiar, Nilesh Badwe, et al. · 14
Thermal cycling induced interconnect stability degradation mechanism in low melting temperature solder joints
2022 · Kendra Young, Raiyo Aspandiar, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 9
Comparative Mechanical Behavior of Sn-Bi based Low Temperature Solder Alloys under Different Pretest Aging Conditions
2023 · Sukshitha Achar P.L., Colin V. Greene, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
High-temperature mechanical properties and fatigue of nanocrystalline nickel-cobalt-phosphorous (NiCoP) alloy
2021 · Nilesh Badwe, Paresh Daharwal, et al. · Materialia · 7
High Temperature Mechanical Properties of Nano-twinned Copper
2024 · Gulnaz Parween, Bo-Yan Chen, et al. · IEEE Electron Devices Technology & Manufacturing Conference (EDTM) · 3
Nanocrystalline copper for thermally efficient Cu-Cu bonding
2025 · Ankush Kumar, Chih Chen, et al. · Journal of the Taiwan Institute of Chemical Engineers · 2
Strain rate-dependent thermo-mechanical response of nanotwinned copper
2026 · Gulnaz Parween, Kang-Ping Lee, et al. · Journal of Materials Science Materials in Electronics · 1
Fracture of Nanoporous Gold
2014 · Nilesh Badwe · 1
Effect of alloying additions on the electrical resistivity of Sn–Bi-based solders
2026 · Radhakrishnan Sriram, Gulnaz Parween, et al. · MRS Communications
Strain Softening Behavior and Impact of Microalloying in SnBi Solder Alloys
2026 · Sean Y. Lai, Hannah N. Fowler, et al. · Journal of Electronic Materials
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Heat Transfer Performance and Durability of Electrodeposited Bi-conductive Microporous Coatings in Saturated Pool Boiling
2026 · Gyanesh Kumar, Ramjan Mallick, et al. · National and International ISHMT-ASTFE Heat and Mass Transfer Conference (IHMTC)
Deformation Mechanism of Eutectic Sn-58Bi Solder
2025 · Gulnaz Parween, Nilesh Badwe · IEEE International Conference on Emerging Electronics (ICEE)
Thermal Stabilization of Nanocrystalline Nickel Through Minor Tin Addition
2025 · Alka Jangid, Pradipta Ghosh, et al. · JOM
Optimization of Plating Parameters for Nanocrystalline Copper for Realizing Low Temperature Cu-Cu Bonding
2024 · Ankush Kumar, Chih Chen, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
Future novel memory device fabrication, heterogenous integration and packaging innovations
2024 · Chong Leong Gan, Chen-Yu Huang, et al. · Materials Science in Semiconductor Processing
Intermetallic Compound Growth and Gold Embrittlement Effect in Sn-Bi Low Temperature Solders in Contact with Electroless Nickel Emersion Gold (ENIG) Surface Finish
2020 · Yaohui Fan, Yifan Wu, et al. · SMTA International
Thermodynamic and Kinetic Effects on Microstructure Evolution in Hybrid Low Temperature Solder/High-Sn Solder Joints
2019 · Yaohui Fan, Yifan Wu, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
Solder Paste: Fundamental Material Property/SMT Performance Correlation
2018 · Nilesh Badwe, Shunfeng Cheng, et al. · SMTA International
Works count: 25
Citation count: 503
H-index: 9
I10-index: 8
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