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G. Angénieux

Time domain characterization of lossy arbitrary characteristic impedance transmission lines
1994 · P. Ferrari, B. Flechet, et al. · IEEE Microwave and Guided Wave Letters · 37
A complete calibration procedure for time domain network analyzers
2003 · P. Ferrari, G. Angenieux, et al. · IEEE MTT-S International Microwave Symposium digest · 24
Calibration of a time-domain network analyzer: a new approach
2000 · P. Ferrari, G. Angenieux · IEEE Transactions on Instrumentation and Measurement · 19
Extraction of material parameters in NbN multilayer technology for RSFQ circuits
1999 · J.-C. Villegier, B. Delaet, et al. · Physica C Superconductivity · 16
Wide band frequency and in situ characterisation of high permittivity insulators (High-K) for H.F. integrated passives
2006 · T. Lacrevaz, B. Fléchet, et al. · Microelectronic Engineering · 13
A simulation technique for the evaluation of random error effects in time-domain measurement systems
2001 · P. Ferrari, G. Angenieux · IEEE Transactions on Instrumentation and Measurement · 13
Proximity Effects of Interconnection Lines in High Speed Integrated Logic Circuits
2006 · J. Chilo, G. Angenieux, et al. · European Microwave Conference (EuMC) · 11
A simple and systematic method for the design of tapered nonlinear transmission lines
2002 · A. Jrad, P. Ferrari, et al. · IEEE MTT-S International Microwave Symposium digest · 8
On-chip high-frequency diagnostic of RSFQ logic cells
2001 · P. Febvre, J.-C. Berthet, et al. · IEEE Transactions on Applied Superconductivity · 8
Enhanced Nicolson's method for Fourier transformof step-like waveforms
1996 · P. Ferrari, L. Duvillaret, et al. · Electronics Letters · 7
Full-wave description of propagation and losses in quasi-planar transmission lines by quasi-analytical solution
1994 · Jun-Wu Tao, G. Angenieux, et al. · IEEE Transactions on Microwave Theory and Techniques · 6
Shielding effectiveness assessement of a coaxial cable design with a combination of numerical and analytical solutions
2019 · Clement Pornin, Tan Phu Vuong, et al. · International Symposium on Electromagnetic Compatibility - EMC Europe (EMC Europe) · 5
Impact of dielectrics and metals properties on electrical performances of advanced on-chip interconnects
2003 · C. Bermond, B. Flechet, et al. · IEEE International Interconnect Technology Conference (IITC) · 4
Microwave characterization of thin film materials for interconnections of advanced packaging
2002 · B. Flechet, R. Salik, et al. · International Symposium on Advanced Packaging Materials · 4
A rigorous method to evaluate the electrical performance of MCM interconnections in frequency and time domains
1996 · R. Salik, Jun-Wu Tao, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 4
CAD Formulas for Modelling the Interconnections of Fast GaAs Integrated Circuits
1985 · J. Chilo, G. Angenieux, et al. · European Microwave Conference (EuMC) · 4
Impact of Design on High-Frequency Performance of Advanced MIM Capacitors Using Si$_{3}$N$_{4}$ Dielectric Layers
2008 · J. Piquet, C. Bermond, et al. · IEEE Transactions on Components and Packaging Technologies · 3
Capacitive impacts of dummies on interconnect propagation performances for integrated circuits of the 65 nm node and below
2005 · B. Blampey, B. Flechet, et al. · IEEE International Interconnect Technology Conference (IITC) · 3
Optimization of signal propagation performances in interconnects of the 45 nm node by exhaustive analysis of the technological parameters impact
2005 · A. Farcy, O. Cueto, et al. · IEEE International Interconnect Technology Conference (IITC) · 3
Wide band frequency and in situ characterization of high permittivity insulators (high-k) for high-speed integrated passives
2005 · T. Lacrevaz, B. Fléchet, et al. · Microelectronic Engineering · 3
Choice of CPW characteristic impedance forlossy nonlinear transmission lines synthesis
1999 · A. Jrad, P. Ferrari, et al. · Electronics Letters · 3
Impact of Design on High Frequency Performances of Advanced MIM Capacitors Using SiN Dielectric Layers
2005 · J. Piquet, C. Bermond, et al. · IEEE MTT-S International Microwave Symposium digest · 2
Impact of copper dummies on interconnect propagation performance in advanced integrated circuits
2004 · B. Blampey, B. Fléchet, et al. · Microelectronic Engineering · 2
Performance Characterization of Advanced Interconnects on High Speed VLSI Circuits
2000 · C. Bermond, B. Flechet, et al. · European Solid-State Device Research Conference · 2
A combined algorithm for optimizing microwave components models in time domain
1995 · N.E. Sifi, G. Angenieux, et al. · IEEE Transactions on Magnetics · 2
Works count: 55
Citation count: 215
H-index: 8
I10-index: 7
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