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Robert Schwerz

Observed names: R. Schwerz, Schwerz, R., Schwerz, Robert, Schwerz, Robert 1983-
ORCID: 0000-0002-7954-3811
Observed ORCID: 0000-0002-7954-3811
OpenAlex ID: A5054331469
Reliability analysis of encapsulated components in 3D-circuit board integration
2018 · R. Schwerz, M. Roellig, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 13
Reliability assessment of discrete passive components embedded into PCB core
2014 · R. Schwerz, M. Roellig, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 12
Finite element modeling on thermal fatigue of BGA solder joints with multiple voids
2011 · Robert Schwerz, Sebastian Meyer, et al. · International Spring Seminar on Electronics Technology · 11
Heat haze effects in thermal chamber tensile tests on digital image correlation
2018 · A. Yuile, R. Schwerz, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 9
Robust and reliable encapsulation of electronics for underwater applications
2016 · R. Schwerz, M. Roellig, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 7
Reliability of embedding concepts for discrete passive components in organic circuit boards
2013 · R. Schwerz, B. Boehme, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Evaluation of embedded IC approach for automotive application
2013 · R. Schwerz, K. Meier, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 7
Influence analysis of joint attributes on the fatigue progress of SnAgCu solder joints under thermomechanical loading
2022 · Rika Berger, Robert Schwerz, et al. · Microelectronics Reliability · 4
FEM-study for Solder Model Comparison on Solder Joints Stress-Strain Effects
2020 · R. Schwerz, R. Metasch, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4
Numerical study on the influence of material models for tin-based solder alloys on reliability statements
2019 · R. Metasch, R. Schwerz, et al. · European Microelectronics and Packaging Conference · 4
Lifetime assessment of BGA solder joints with voids under thermo-mechanical load
2012 · Robert Schwerz, Mike Roellig, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4
Non-linear viscoelastic Material Models of Polymers for Electronics Simulation - Measurement, Modelling, Validation
2024 · R. Schwerz, M. Roellig · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 3
Experimental Verification of FE-Models for Thermo- Mechanical Loading using Digital Image Correlation
2018 · Robert Schwerz, Rene Metasch, et al. · Electronic System-Integration Technology Conference (ESTC) · 3
Experimental investigation on microstructural influence towards visco-plastic mechanical properties of Sn-based solder alloy for material modelling in finite element simulations
2015 · R. Metasch, R. Schwerz, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 3
Parameters of the manufacturing process and reliability of embedded components
2013 · Sergii Osmolovskyi, Robert Schwerz, et al. · International Spring Seminar on Electronics Technology · 3
Guided Wave Based SHM Approach Using SAFT-Algorithm for Impact Detection in Composite Materials
2011 · Lars Schubert, R. Schwerz, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 3
Macro- and Microscopic DMA measurements - Complementary techniques to determine viscoelastic material properties of packaging polymers
2022 · A. Clausner, S. Schlipf, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 2
FEM Modelling of Ag-Sinter Joints with Respect of Porosity and Sinter Pressure
2023 · M. Roellig, R. Schwerz, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 1
Optimized TMF Measurement Setup for Reproducible Lifetime Measurements on Solder Joints Under Accelerated Thermal-Mechanical Conditions
2022 · R. Metasch, M. Roellig, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 1
Relevance Evaluation of Solder Joints Attributes to Reduce the Variance of the Lifetime Model
2021 · Rika Berger, Robert Schwerz, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 1
Process and material effects on BGA board level solder joint reliability
2011 · Sebastian Meyer, Rene Metasch, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1
In‑situ acousto‑ultrasonic monitoring of Type IV hydrogen pressure vessels using surface‑embedded piezoelectric networks
2026 · Kilian Tschöke, Georg Lautenschläger, et al. · e-Journal of Nondestructive Testing
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Comparison between Linear and Nonlinear Modelling of Viscoelastic Material Behaviour on the Example of Polymer Encapsulation for Advanced Electronic Virtual Design
2026 · Robert Schwerz, Mike Röllig · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Modelling of Nonlinear, Viscoelastic Material Behaviour for Highly Deformed Polymers towards Accurate Virtual Design in Advanced Electronic Development
2025 · R. Schwerz, M. Roellig · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Optical Deformation Measurement for Validation of Thermo-Mechanical FEM Models and Material Behavior in Electronics
2021 · R. Schwerz, M. Roellig, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Works count: 37
Citation count: 106
H-index: 7
I10-index: 3
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