Author

Bill Zivasatienraj

Observed name: Zivasatienraj, Bill
ORCID: 0000-0002-0522-4869
Observed ORCID: 0000-0002-0522-4869
OpenAlex ID: A5054692364
2021 · Bill Zivasatienraj, M. Brooks Tellekamp, et al. · Crystals · 34
2018 · Joshua C. Shank, M. Brooks Tellekamp, et al. · Scientific Reports · 30
2026 · Connor Devitt, Sudhanshu Tiwari, et al. · Nature · 20
2020 · Darshan G. Pahinkar, Pradip Basnet, et al. · AIP Advances · 20
2020 · Bill Zivasatienraj, M. Brooks Tellekamp, et al. · Journal of Applied Physics · 19
2025 · Daniel C. Shoemaker, Kelly Woo, et al. · IEEE Electron Device Letters · 11
2025 · Biddut K. Sarker, Nicholas P. Sepelak, et al. · Applied Physics Letters · 7
2021 · Habib Ahmad, Zachary Engel, et al. · Semiconductor Science and Technology · 7
2023 · Bill Zivasatienraj, W. Alan Doolittle · Frontiers in Neuroscience · 5
2022 · Aheli Ghosh, Alex S. Weidenbach, et al. · IEEE Transactions on Electron Devices · 5
2020 · Aheli Ghosh, Bill Zivasatienraj, et al. · ECS Journal of Solid State Science and Technology · 4
2019 · Darshan G. Pahinkar, Pradip Basnet, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 4
2026 · Seokjun Kim, Daniel C. Shoemaker, et al. · IEEE Transactions on Electron Devices · 1
2022 · Bill Zivasatienraj, W. Alan Doolittle · Conference digest · 1
2026 · Seokjun Kim, Daniel C. Shoemaker, et al. · Journal of Electronic Packaging
2026 · Daniel C. Shoemaker, Seokjun Kim, et al. · IEEE Transactions on Electron Devices
2025 · Seokjun Kim, Daniel C. Shoemaker, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
2025 · Seokjun Kim, Daniel C. Shoemaker, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
Works count: 21
Citation count: 172
H-index: 7
I10-index: 6
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