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Robin Taylor
Observed name:
R. Taylor
Institutions:
Georgia Institute of Technology,
Atotech (Germany)
Observed institutions:
Georgia Institute of Technology,
Atotech (Germany)
OpenAlex ID:
A5054698892
The world in 2025 - predictions for the next ten years
2015
·
Robin Taylor
, David Baron
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
73
Demonstration of 3–5 μm RDL line lithography on panel-based glass interposers
2014
·
Hao Lu
, Yutaka Takagi
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
23
Enabling Chip-to-Substrate All-Cu Interconnections: Design of Engineered Bonding Interfaces for Improved Manufacturability and Low-Temperature Bonding
2017
·
Ninad Shahane
, Kashyap Mohan
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
15
Modeling, design and demonstration of low-temperature, low-pressure and high-throughput thermocompression bonding of copper interconnections without solders
2015
·
Ninad Shahane
, Scott McCann
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
14
Scaling Cu Pillars to 20um Pitch and Below: Critical Role of Surface Finish and Barrier Layers
2017
·
Ting-Chia Huang
, Vanessa Smet
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
6
Challenges of Adhesion Promotion for the Metallization of Glass Interposers
2013
·
Simon Bamberg
, Michael Merschy
, et al.
·
IMAPSource Proceedings
·
5
Using a Metal Oxide Adhesion Layer and Wet Chemical Cu Metallization for Fine Line Pattern Formation on Glass
2017
·
Michael Merschky
, Fabian Michalik
, et al.
·
IMAPSource Proceedings
·
4
Demonstration of Next-Generation Au-Pd Surface Finish with Solder-Capped Cu Pillars for Ultra-Fine Pitch Applications
2016
·
Ting-Chia Huang
, Vanessa Smet
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
4
The influence of intermetallic compounds on high speed shear testing with a specific interest in Electroless Palladium and Autocatalytic Gold
2017
·
R. Nichols
, G. Ramos
, et al.
·
IEEE CPMT Symposium Japan (ICSJ)
·
3
MultiPlate- from wafer to panel-new solutions for electrolytic cu deposition in advanced packaging
2016
·
Robin Taylor
, Bernd Roelfs
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
1
Advances in Fine Pitch Off-Chip Interconnections Through the Use of a Novel Surface Finish
2015
·
Arnd Kilian
, Gustavo Ramos
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
Organic and Printed Electronics a View from the Traditional Market Place
2010
·
David Baron
, Frank Bruening
, et al.
·
SMTA International
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Works count:
12
Citation count:
148
H-index:
5
I10-index:
4
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