Get started
Author

Kohei Mitsui

Observed name: Kohei MITSUI
ORCID: 0009-0002-2024-2915
Observed ORCID: 0009-0002-2024-2915
OpenAlex ID: A5055644875
Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder
2021 · Mizuki Yamamoto, Ikuo Shohji, et al. · Materials · 23
PDF
Comparison of Sn‐5Sb and Sn‐10Sb Alloys in Tensile and Fatigue Properties Using Miniature Size Specimens
2018 · Tatsuya Kobayashi, Kyosuke Kobayashi, et al. · Advances in Materials Science and Engineering · 22
PDF
Effects of Ni Addition to Sn–5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties
2019 · Tatsuya Kobayashi, Kohei Mitsui, et al. · MATERIALS TRANSACTIONS · 13
PDF
Effect of Addition of Trace Ni and Ge into Sn-Sb-Ag High Temperature Lead-free Solder Alloy on its Mechanical Properties
2020 · Kohei MITSUI, Ikuo SHOHJI, et al. · Journal of Smart Processing · 5
PDF
Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens
2018 · Tatsuya Kobayashi, Masaki Yokoi, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 3
Microstructural Change Due to Aging and Its Effect on Fatigue Properties in Sn-Sb-Ag-Ni-Ge Alloy
2026 · Kohei Mitsui, Hirohiko Watanabe, et al. · Materials
Sn-Sb-Ag Solder Alloy which Achieves High-Temperature Operation and High Reliability of Power Semiconductors
2025 · Kohei Mitsui, Hirohiko Watanabe, et al. · Journal of The Japan Institute of Electronics Packaging
Effect of Additive Element on Fatigue Properties of Sn-Sb-Ag High Temperature Lead-Free Solder
2023 · Kohei Mitsui, Mizuki Yamamoto, et al. · Journal of The Japan Institute of Electronics Packaging
Effect of Added Element on Power Cycle Damag e Behavior of Die Bonded Joints with or of Die Bonded Joints with S n-Sb-Ag Solder
2022 · Yuta YAMANAKA, Ikuo SHOHJI, et al. · Journal of Smart Processing
PDF
Works count: 9
Citation count: 66
H-index: 4
I10-index: 3
Year
Topic
Type