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Seong Min Seo

Institution: Hoseo University
ORCID: 0009-0002-5364-2499
Observed ORCIDs: 0009-0002-5364-2499, 0000-0002-8935-8441
OpenAlex ID: A5055717238
A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process
2021 · Do Hoon Cho, Seong Min Seo, et al. · Metals · 80
Effect of 0D and 1D ZnO nano additive reinforced Sn-3.0Ag-0.5Cu solder paste on InGaN LED chip/ENIG joints
2023 · Sri Harini Rajendran, Seong Min Seo, et al. · Materials Today Communications · 10
Three-Dimesnional Semicondoctor Stacking using TSV(Through-Si-Via) Technology
2021 · Do Hoon Cho, Hye Jun Kang, et al. · Journal of Welding and Joining · 6
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Solving Reliability Problems of Transfer Molding Press Equipment Using TRIZ Contradictions
2023 · Soo Yeon Ko, Yong Won Song, et al. · Asia-pacific Journal of Convergent Research Interchange · 2
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Verification of LNG Dispersion Simulation Using FDS Based on Burro3 Experimental Results
2026 · Seong Min Seo, Dongho Jung, et al. · Journal of Ocean Engineering and Technology · 1
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Ultrasonic dispersion of nanocomposite solder for microelectronic packaging
2022 · Sri Harini Rajendran, Hyejun Kang, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 1
Validation of FDS-Based Gas Dispersion Simulation Using Burro and Redsquirrel Experiments
2026 · Seong Min Seo, Dongho Jung, et al. · International Conference on Offshore Mechanics and Arctic Engineering (OMAE)
A Study on the Improvement of HCR Screw Shape in Oxide Etcher Equipment Using TRIZ's 40 Inventive Principles
2025 · Soo Yeon Ko, Yong Won Song, et al. · Asia-pacific Journal of Convergent Research Interchange
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A Study on Improving the Heat Transfer Path of Semiconductor Equipment Using TRIZ
2024 · Hong Kyun Shim, Yong Won Song, et al. · Asia-pacific Journal of Convergent Research Interchange
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Eutectic Bonding in Sequential Bi and Sn Layers for Low-Temperature Interconnections
2024 · Sri Harini Rajendran, Jae Pil Jung, et al. · International Conference on Electronics Packaging (ICEP)
Effect of Nanoparticle on Microstructure and Mechanical Properties of Aluminum Alloy for Vehicles
2023 · Jae Pil Jung, Do Hyun Jung, et al. · Proceedings of the International Conference of Theoretical and Applied Nanoscience and Nanotechnology
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Characteristics of SAC305 and Nano-Particle Dispersed Solders
2021 · Jang Baeg Kim, Seong Min Seo, et al. · Journal of the Microelectronics and Packaging Society
Hydrophobicity characterization study based on film thickness
2015 · Jeong Byung Chae, Sung Jin Hong, et al. · 한국CDE학회 학술발표회 논문집
Works count: 13
Citation count: 100
H-index: 3
I10-index: 2
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