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Author

Dayuan Jin

Observed name: Jin Dayuan
OpenAlex ID: A5055784751
A digital twin framework of reflow soldering based on a novel high dimension surrogate model
2023 · Fan Ye, Dayuan Jin, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 4
Research on Heat Dissipation Technology of the High-Power Array Antenna
2019 · Jiawei Ge, Dayuan Jin, et al. · Lecture notes in electrical engineering · 4
Application of Three-Dimensional Wiring Technology in Electronic Device
2019 · Jixiang Yang, Jun Xu, et al. · Lecture notes in electrical engineering · 2
Program Design of Forced Air Cooling System Based on Genetic Algorithm
2022 · Jiawei Ge, Dayuan Jin, et al. · Lecture notes in electrical engineering · 1
Systematic Verification of BGA Solder Joint Reliability in Multiple Ways
2019 · Wei Lu, Dayuan Jin, et al. · Lecture notes in electrical engineering · 1
Study on Assembly and Welding Process of High-Density Lead Devices in Aerospace Products
2022 · Wei Lu, Dayuan Jin · Lecture notes in electrical engineering
Comparative Study on FEM Simulations and Experiments of Pyroshock Environment for Aerospace Electronic Products
2022 · Chenjun Wu, Dayuan Jin, et al. · Lecture notes in electrical engineering
Research on Shipboard Button Design Based on Behavioral Psychology
2022 · Yuzhe Xu, Yu Zhao, et al. · Lecture notes in electrical engineering
Concurrent Multi-scale Design of Hybrid Composite Antenna
2022 · Fan Ye, Dayuan Jin, et al. · Lecture notes in electrical engineering
Research on SOP Analysis Product Design Method in Ergonomics
2022 · Yu Zhao, Weijie Xu, et al. · Lecture notes in electrical engineering
Wiring Process for RF Cables with Equal Phase
2022 · Jixiang Yang, Jianqiang Lv, et al. · Lecture notes in electrical engineering
BGA Solder Ball Attaching Process Using Surface Tension of Liquid Solder
2022 · Xin Xie, Dayuan Jin, et al. · Lecture notes in electrical engineering
The intelligent design of reflow soldering based on an improved high-dimensional surrogate assisted optimization method
2022 · Fan Ye, Dayuan Jin, et al. · Procedia Computer Science
CCGA Failure Analysis by Cutting Columns in Horizontal Cross-Section
2019 · Xin Xie, Dayuan Jin, et al. · Lecture notes in electrical engineering
The Cleaning Process Scheme of Polluted Liquid Cooling Pipeline of a Electronic Equipment
2019 · Jun Xu, Dayuan Jin, et al. · Lecture notes in electrical engineering
Research on Large Area Soldering Process for Microwave RF Module Based on DOE Method
2018 · Jin Dayuan, Xie xin, et al. · International Conference on Electronic Packaging Technology (ICEPT)
Works count: 16
Citation count: 12
H-index: 2
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