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Henry Barth

Observed names: Barth, Henry, Barth, Henry 1980-, H. Barth
ORCID: 0000-0003-4021-6511
Observed ORCID: 0000-0003-4021-6511
OpenAlex ID: A5055911412
Additive manufacturing of ceramic single and multi-material components–A groundbreaking innovation for space applications too?
2024 · Uwe Scheithauer, Eric Schwarzer-Fischer, et al. · Acta Astronautica · 12
Potentials and Boundaries of Discrete SiC-Transistors in AC Drives
2018 · Henry Barth, Wilfried Hofmann · European Conference on Power Electronics and Applications · 8
Decrease of SiC-BJT driver losses by one-step commutation
2014 · Henry Barth, Wilfried Hofmann · International Power Electronics Conference (IPEC) · 5
Additive Fertigung von keramikbasierten Multimaterialbauteilen mittels CerAM MMJ
2021 · Steven Weingarten, Uwe Scheithauer, et al. · Keramische Zeitschrift · 3
Efficiency increase of SiC-BJT inverter by driver loss reduction with one-step commutation
2014 · Henry Barth, Wilfried Hofmann · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 3
Handling and Analysis of Large Datasets Using the Example of Partial Discharge Measurement
2022 · Johannes Drechsel, Henry Barth, et al. · International Spring Seminar on Electronics Technology · 1
Evaluation of Partial Discharge Measurement as a Non-Destructive Measurement Procedure for Ceramic Substrates
2021 · Johannes Drechsel, Henry Barth, et al. · International Spring Seminar on Electronics Technology · 1
A7.2 Evaluation of High Temperature Ceramic Sensor Packages
2021 · P. Gierth, L. Rebenklau, et al. · Sensor and Measurement Science International (SMSI) · 1
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Prozesszeiten- und Energieeinsparung in medizinischen und technischen Prozessen durch additiv gefertigte und funktionalisierte keramische Bauteile
2021 · Uwe Scheithauer, Lars Rebenklau, et al. · Carl Hanser Verlag GmbH & Co. KG eBooks · 1
Insulation Layers on Copper Surfaces of Ceramic Circuit Boards for Smart Power Modules
2025 · Claudia Feller, Henry Barth, et al. · European Microelectronics and Packaging Conference
Partial Discharge Characterization of Ceramic Power Electronics Circuit Carriers Assisted by Machine Learning
2024 · Johannes Drechsel, Henry Barth, et al. · IMAPSource Proceedings
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Partial discharge behaviour analysis of silicon nitride ceramics
2024 · Johannes Drechsel, Henry Barth, et al. · Power Electronic Devices and Components
Partial Discharge Characterization of Ceramic Power Electronics Circuit Carriers Assisted by Machine Learning
2023 · Johannes Drechsel, Henry Barth, et al. · European Microelectronics and Packaging Conference
Partial Discharge Behaviour Analysis of Silicon Nitride Ceramics
2023 · Johannes Drechsel, Henry Barth, et al. · International Spring Seminar on Electronics Technology
Thermal Characterization of the Interconnection of Semiconductors on Thin Copper and Silver Layers Using Infrared Thermography
2023 · Mirko Kirchhoff, Henry Barth, et al. · International Spring Seminar on Electronics Technology
Marriage of Technologies – Hybridization of Materials and Manufacturing Technologies for Ceramic Components
2021 · Schwarzer, Eric, Abel, Johannes, et al. · Fraunhofer-Publica (Fraunhofer-Gesellschaft)
Works count: 25
Citation count: 36
H-index: 3
I10-index: 1
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