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Keisuke Wakamoto

Observed names: K. Wakamoto, Keisuke WAKAMOTO, Wakamoto, Keisuke
Institution: ROHM
ORCID: 0000-0002-9302-7223
Observed ORCID: 0000-0002-9302-7223
OpenAlex ID: A5056652257
Mechanical Characterization of Sintered Silver Materials for Power Device Packaging: A Review
2024 · Keisuke Wakamoto, Takahiro Namazu · Energies · 61
Tensile mechanical properties of sintered porous silver films and their dependence on porosity
2019 · Keisuke Wakamoto, Yo Mochizuki, et al. · Japanese Journal of Applied Physics · 38
Novel SIMS system with focused massive cluster ion source for mass imaging spectrometry with high lateral resolution
2014 · Jiro Matsuo, Souta Torii, et al. · Applied Physics Express · 36
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Temperature Dependence on Tensile Mechanical Properties of Sintered Silver Film
2020 · Keisuke Wakamoto, Yo Mochizuki, et al. · Materials · 34
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Degradation Mechanism of Silver Sintering Die Attach Based on Thermal and Mechanical Reliability Testing
2023 · Keisuke Wakamoto, Takukazu Otsuka, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 33
Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test
2021 · Keisuke Wakamoto, Takukazu Otsuka, et al. · Energies · 29
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Fracture Mechanism of Sintered Silver Film Revealed by In Situ SEM Uniaxial Tensile Loading
2024 · Keisuke Wakamoto, Daisuke Yasugi, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 23
Nine Point Bending Test Technique for Understanding of Sintered Silver Die Bonding Failure Mechanism
2023 · K. Wakamoto, K. Fuji, et al. · Experimental Techniques · 17
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Comparison of sintered silver die attach failure between thermal shock test and mechanical cycling test
2022 · Keisuke Wakamoto, Yuga Kumakiri, et al. · Japanese Journal of Applied Physics · 17
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Mechanical property changes in sintered silver films by including copper oxide nanoparticles
2024 · Keisuke Wakamoto, Yuga Kumakiri, et al. · Microelectronics Reliability · 9
Increased high-temperature stiffness of an epoxy-based molding compound through high-temperature storage
2025 · Masaya Ukita, Keisuke Wakamoto, et al. · Microelectronics Reliability · 6
Formation of Wavy Crack in Double-Layered Ag and CuO/Ag Sintering Die Attach Assemblies Subjected to Thermal Shock Testing
2024 · Daisuke Yasugi, Keisuke Wakamoto, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 5
The Influence of Mechanical Property on the Heat-Cycle Reliability of Sintered Silver Die Attach
2020 · Keisuke Wakamoto, Yo Mochizuki, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 2
Evaluating Sintered Silver Die-attach Thermal Cycling Degradation by Nine Point Cycling Bending Test
2022 · Keisuke Wakamoto, Takukazu Otsuka, et al. · International Conference on Solid State Devices and Materials (SSDM) · 1
Advanced die-attach validation technologies
2021 · Keisuke Wakamoto, Ryosuke Matsumoto, et al. · Institution of Engineering and Technology eBooks · 1
(Tensile Mechanical Fatigue Properties of Sintered Porous Silver Films)
2019 · Keisuke Wakamoto, Yo Mochizuki, et al. · The Proceedings of Mechanical Engineering Congress Japan · 1
Non-destructive Analysis of Molecular Behavior and Deterioration at the Buried Epoxy/Silver Interfaces
2026 · Risako Kameyama, Kotaro Katsumori, et al. · AIP Publishing
Non-destructive analysis of molecular behavior and deterioration at the buried epoxy/silver interfaces
2026 · Kotaro Katsumori, Misaki Ikeda, et al. · The Journal of Chemical Physics
Supporting Information documents and figures
2026 · Kotaro Katsumori, Misaki Ikeda, et al. · AIP Publishing
Correlation of silver and epoxy molding compounds interface delamination between joint tensile test and mechanical cycling test
2026 · Masaya Ukita, Keisuke Wakamoto, et al. · Microelectronics Reliability
Quantitative Reliability Design Framework for Pressureless Sintered Silver Joints Based on Accumulated Plastic Strain
2026 · Keisuke Wakamoto, Ayumi Saito, et al. · IEEE Open Journal of Power Electronics
A Novel Uniaxial Tensile Test Simulating Delamination Between Resin and Metal
2025 · Masaya Ukita, Keisuke Wakamoto, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Thermo-oxidation Effect on the Tensile Mechanical Properties of the Epoxy Molding Compounds at Elevated Temperature
2025 · Ayumi Saito, Masaya Ukita, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
The Improved Lifetime of Anisotropically Porous Pressurized Sintered Silver Die Attach
2025 · Keisuke Wakamoto, Masaya Ukita, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Silica Fillers Embedded in Epoxy Molding Compound Cause Inner Stress Concentration
2025 · Ayumi Haginiwa, Masaya Ukita, et al. · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Works count: 40
Citation count: 315
H-index: 9
I10-index: 9
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