Get started
Author

Allen Gu

Observed name: Gu, Allen
ORCID: 0000-0001-8503-6069
Observed ORCID: 0000-0001-8503-6069
OpenAlex ID: A5058511646
Multi-scale method of Nano(Micro)-CT study on microscopic pore structure of tight sandstone of Yanchang Formation, Ordos Basin
2013 · Bin BAI, Rukai ZHU, et al. · Petroleum Exploration and Development · 231
PDF
Lithiation‐Induced Dilation Mapping in a Lithium‐Ion Battery Electrode by 3D X‐Ray Microscopy and Digital Volume Correlation
2013 · David S. Eastwood, Vladimir Yufit, et al. · Advanced Energy Materials · 116
Biomechanics and strain mapping in bone as related to immediately-loaded dental implants
2015 · Jing Du, Ji-Hyun Lee, et al. · Journal of Biomechanics · 55
High-res 3D X-ray microscopy for non-destructive failure analysis of chip-to-chip micro-bump interconnects in stacked die packages
2017 · Syahirah Md Zulkifli, Bemice Zee, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 29
From PCB to BEOL: 3D X-Ray Microscopy for Advanced Semiconductor Packaging
2018 · Cheryl Hartfield, Christian Schmidt, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 25
From System to Package to Interconnect: An Artificial Intelligence Powered 3D X-ray Imaging Solution for Semiconductor Package Structural Analysis and Correlative Microscopic Failure Analysis
2022 · Allen Gu, Masako Terada, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 18
Accelerate Your 3D X-ray Failure Analysis by Deep Learning High Resolution Reconstruction
2021 · Allen Gu, Andriy Andreyev, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 14
High resolution 3D X-ray microscopy for streamlined failure analysis workflow
2016 · C. Y. Liu, P. S. Kuo, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 14
High-resolution 3D X-ray Microscopy for Structural Inspection and Measurement of Semiconductor Package Interconnects
2019 · Syahirah Mohammad-Zulkifli, Bernice Zee, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 10
Emerging Technologies for Advanced 3D Package Characterization to Enable the More-Than-Moore Era
2022 · Cheryl Hartfield, Will Harris, et al. · ECS Transactions · 9
PDF
A Deep Learning Reconstruction Technique and Workflow to Enhance 3D X-ray Imaging Resolution and Speed for Electronics Package Failure Analysis
2023 · Allen Gu, Andriy Andreyev, et al. · International Conference on Electronics Packaging (ICEP) · 6
Fully automated deep-learning-based resolution recovery
2022 · Matthew Andrew, Andriy Andreyev, et al. · International Conference on Image Formation in X-Ray Computed Tomography (CT Meeting) · 6
PDF
Detecting Wafer-Level Cu Pillar Defects using Advanced 3D X-ray Microscopy (XRM) with Submicron Resolution
2024 · Susan Li, John Frame, et al. · Journal of Failure Analysis and Prevention · 5
A Path Toward Non-Destructive 3D Metrology for Through-Silicon Vias
2011 · Jeff Gelb, LayWai Kong, et al. · IMAPSource Proceedings · 5
An Artificial Intelligence Powered Resolution Recovery Technique and Workflow to Accelerate Package Level Failure Analysis with 3D X-ray Microscopy
2023 · Syahirah Mohammad-Zulkifli, Bernice Zee, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 4
A Breakthrough in Resolution and Scan Speed: Overcome the Challenges of 3D X-ray Imaging Workflows for Electronics Package Failure Analysis
2023 · Allen Gu, Gerhard Krampert, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 4
Fully automated deep learning-based resolution recovery
2022 · Matthew Andrew, Andriy Andreyev, et al. · Developments in X-Ray Tomography · 4
Putting AI to Work: A Practical and Simple Application to Improve 3D X-ray FA
2022 · William Harris, Allen Gu, et al. · IEEE International Reliability Physics Symposium proceedings · 4
Application of 3D X-Ray Microscopy for 3D IC Process Development
2016 · Teng Wang, Ingrid De Wolf, et al. · Wafer-Level Packaging Symposium · 4
X-ray microscopy for in situ characterization of 3D nanostructural evolution in the laboratory
2015 · Benjamin Hornberger, Hrishikesh Bale, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 4
Batteries: Lithiation‐Induced Dilation Mapping in a Lithium‐Ion Battery Electrode by 3D X‐Ray Microscopy and Digital Volume Correlation (Adv. Energy Mater. 4/2014)
2014 · David S. Eastwood, Vladimir Yufit, et al. · Advanced Energy Materials · 4
A Correlative Microscopic Workflow Powered by Artificial Intelligence to Accelerate Failure Analysis of Next-Generation Semiconductor Packages
2024 · Yu-Jen Chang, Cheng-Hsin Liu, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 3
Workflows for assessing electronic devices with 3D X-ray microscopy and nanoscale computed tomography
2023 · Carl Zeiss Industrial Metrology, Herminso Villarraga-Gómez, et al. · e-Journal of Nondestructive Testing · 3
PDF
3D Measurement Workflow for Packaging Development and Production Control Using High-Resolution 3D X-ray Microscope
2018 · Allen Gu, John Auyoong · IEEE Electronics Packaging Technology Conference (EPTC) · 3
A Correlative Microscopic Workflow For Nanoscale Failure Analysis and Characterization of Advanced Electronics Packages
2022 · Thomas Rodgers, Allen Gu, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 2
Works count: 45
Citation count: 597
H-index: 9
I10-index: 9
Year
Topic
Type