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Jonghyun Hong

Observed name: Jong-Hyun Hong
ORCID: 0009-0008-1648-6996
Observed ORCID: 0009-0008-1648-6996
OpenAlex ID: A5058523434
Fouling of microfiltration membranes by natural organic matter after coagulation treatment: A comparison of different initial mixing conditions
2006 · Hyun-Chul Kim, Jong-Hyun Hong, et al. · Journal of Membrane Science · 99
Evaluation of new compact pretreatment system for high turbidity seawater: Fiber filter and ultrafiltration
2012 · Joshua Joohyen Kim, Hyunsoo Yoon, et al. · Desalination · 22
Adaptive Gramian-Angular-Field Segmentation Integration Based Generative Adversarial Network (AGSI-GAN) for Eye Diagram Estimation of High Bandwidth Memory (HBM) Interposer
2023 · Junghyun Lee, Seonguk Choi, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 7
The Significance of Thermal-Aware Universal Chiplet Interconnect Express (UCIe) Interface Design in 2.5D/3D ICs
2023 · Keeyoung Son, Keunwoo Kim, et al. · IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) · 6
Design and Analysis of Redistribution Layer Interposer Channel Considering Signal Integrity for High Bandwidth Memory Module
2023 · Jiwon Yoon, Hyunwook Park, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 6
Design and Analysis of Hierarchical Power Distribution Network (PDN) for Full Wafer Scale Chip (FWSC) Module
2022 · Hyunwoo Kim, Haeyeon Kim, et al. · IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) · 3
Signal Integrity Design and Analysis of Redistribution Layer Interposer Channel with Diagonal Meshed Ground in Memory Interface of High Bandwidth Memory
2023 · Jonghyun Hong, Jiwon Yoon, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 2
Crosstalk Mitigated On-chip Interconnect Design for High-speed Network-on-Chip (NoC) of Full Wafer Scale Chip (FWSC)
2023 · Juneyoung Kim, Seonguk Choi, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 2
Novel Interdigital Capacitor-type Power Distribution Network Design for Power Noise Suppression in Redistribution Layer Interposer
2024 · Haojie Wu, Xinglin Sun, et al. · IEEE International Symposium on Electromagnetic Compatibility · 1
A study on the fouling characteristics of low-pressure membranes and NOM with coagulation pretreatment
2010 · Sanghyuk Park, Jonghyun Hong, et al. · Journal of The Korean Society of Water and Wastewater · 1
Effect of R-R interval normalization on frequency domain analysis of heart rate variability during sleep
2026 · Jonghyun Hong, Jungmin Koh, et al. · Biomedical Engineering Letters
Unobtrusive sleep posture estimation using pressure sensor in home sleep
2026 · Jonghyun Hong, Jungmin Koh, et al. · Computers in Biology and Medicine
ContrastVAE++: Enhancing Contrastive Variational AutoEncoder Performance through Posterior Collapse Alleviation and Language Model-based Data Augmentation
2023 · Joshep Na, Jonghyun Hong, et al. · 한국경영과학회지
Modeling and Analysis of Simultaneous Switching Noise for Full Wafer Scale Chip Core
2023 · Hyunwoo Kim, Seonguk Choi, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
A Study on the Constitutional Meaning and Function of Safety
2021 · Jong-Hyun Hong · The Journal of Legal Studies
A study on the adoption of so-called “Korean fiscal rule”
2021 · Jong-Hyun Hong · Public Law Journal
A Legal Review on the improvement of Local Finance System
2019 · Jong-Hyun Hong · Public Law Journal
소음저감형 시스템 알루미늄 거푸집의 최적 개념디자인 선정
2016 · Jonghyun Hong, Yeom Dong Jun, et al. · Korean Journal of Construction Engineering and Management
Evaluation of imaging reformation for root and pulp canal shapes of permanent teeth using a cone beam computed tomography
2007 · Jonghyun Hong, Gyu‐Tae Kim, et al. · Imaging Science in Dentistry
Works count: 19
Citation count: 149
H-index: 5
I10-index: 2
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