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Simon Landry
Observed name:
Landry, S.
Institution:
Dalsa Corporation
Observed institution:
Dalsa Corporation
ORCID:
0009-0002-6030-3014
Observed ORCID:
0009-0002-6030-3014
OpenAlex ID:
A5059870727
Conductive Direct Bonding of In-situ Doped Polysilicon for Mems Wafer-level Packaging
2024
·
Vincent Pares
, Amrid Amnache
, et al.
·
Solid-State Sensors, Actuators, and Microsystems Workshop (Hilton Head Workshop)
·
1
PDF
Interfacial Electrical and Microstructural Characterization of a Conductive Polysilicon Direct Bonding for MEMS Wafer-Level Packaging
2026
·
Vincent Pares
, Amrid Amnache
, et al.
·
Journal of Microelectromechanical Systems
Chemical Mechanical Polishing of In-Situ-Doped Polysilicon for MEMS Applications
2026
·
Vincent Pares
, Amrid Amnache
, et al.
·
ECS Journal of Solid State Science and Technology
CMP developments in MEMS foundry: Application to direct wafer bonding process
2019
·
Gond-Charton, P
, Landry, S.
, et al.
·
HAL
Carbon nanotube-based multi-sensors for packaging applications and methods to form the carbon nanotube-based multi-sensors are capable of simultaneously measuring at least two measurands including temperature, strain, and humidity via changes in its electrical properties
2018
·
Duchesne, E.
, Drouin, D.
, et al.
·
HAL
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Works count:
5
Citation count:
1
H-index:
1
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