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Zhen-Wei Zhuang

Observed names: Z. W. Zhuang, Z.W. Zhuang, Zhen-Wei ZHUANG
Observed institution: National Chung Cheng University
ORCID: 0000-0002-7194-0599
Observed ORCID: 0000-0002-7194-0599
OpenAlex ID: A5060079243
Relationship between medial plica and medial femoral condyle—a three-dimensional dynamic finite element model
2013 · D.S. Liu, Z.W. Zhuang, et al. · Clinical Biomechanics · 22
A novel identification technique of machine tool support stiffness under the variance of structural weight
2021 · Zhen-Wei Zhuang, Jen-Chang Lu, et al. · The International Journal of Advanced Manufacturing Technology · 10
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Design of a novel chip on glass package solution for CMOS image sensor device
2006 · Ching-Yang Chen, Yung-Ching Chao, et al. · Microelectronics Reliability · 8
Temperature-dependence mechanical characteristics investigation of Cu wire and corresponding high strain rate plasticity behaviors enabled by Johnson–Cook constitutive model
2023 · De-Shin Liu, Po-Chun Wen, et al. · Journal of Mechanics · 7
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Development of Plate Infinite Element Method for Stress Analysis of Elastic Bodies with Singularities
2013 · D. S. Liu, K. L. Cheng, et al. · Journal of Mechanics · 3
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Modeling of Moisture Diffusion in Heterogeneous Epoxy Resin Containing Multiple Randomly Distributed Particles Using Hybrid Moisture Element Method
2009 · De‐Shin Liu, Zhen-Wei Zhuang, et al. · Computers, materials & continua/Computers, materials & continua (Print) · 3
Development of 3D infinite element method coupled with a cylindrical mesh technique for analyzing bending of plate with interacting holes
2025 · De-Shin Liu, Wen-Hsuan Chang, et al. · Journal of Mechanics · 2
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Experimental and Numerical Investigation Into the Influence of Chip-on-Film Package on Component Operating Temperature in Natural Convection
2014 · De-Shin Liu, Zhen-Wei Zhuang, et al. · IEEE Transactions on Device and Materials Reliability · 2
Modeling of Moisture Diffusion in PermeableParticle-Reinforced Epoxy Resins UsingThree-Dimensional Heterogeneous Hybrid MoistureElement Method
2013 · D.S. Liu, Z.H. Fong, et al. · Computer Modeling in Engineering & Sciences · 2
Modeling of moisture diffusion in permeable fiber-reinforced polymer composites using heterogeneous hybrid moisture element method
2011 · De‐Shin Liu, Zhen-Wei Zhuang, et al. · Computers, materials & continua/Computers, materials & continua (Print) · 2
Demonstration of curing degree estimation approach of EVA foam during injection moulding by integrating thermal–physical characteristics and FEA simulation
2024 · Yuk-Wah Tsang, Hsiao-Ju Fu, et al. · Polymer Bulletin · 1
Development of a Novel Dynamic Modeling Approach for a Three-Axis Machine Tool in Mechatronic Integration
2022 · De-Shin Liu, Jen-Chang Lu, et al. · Machines · 1
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Development of High-Order Infinite Element Method for Stress Analysis of Elastic Bodies with Singularities
2010 · De-Shin LIU, Kuo-Liang CHENG, et al. · Journal of Solid Mechanics and Materials Engineering · 1
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Influence of porous architecture and layer-wise double scanning on LPBF-fabricated Ti–6Al–4V cranial-implant plates: Experimental and computational evaluation
2026 · Pai Chen Lin, Hsueh-Chih Liu, et al. · Journal of Materials Research and Technology
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Development of Lattice Cell Element Approach for Elastic Analysis of Additively Manufactured Lattice Structures
2026 · De-Shin Liu, De-Yi Yeh, et al. · SSRN Electronic Journal
Influence of Single-, Double-, and Multi-Walled Carbon Nanotubes on the Dynamic and Quasi-Static Energy Absorption of Aluminum Hybrid Foams
2026 · Dilip Muchhala, B. N. Yadav, et al. · SSRN Electronic Journal
Quasi-Static and Dynamic Deformation Response of SWNTs, DWNTs, and MWNTs Reinforced Hybrid Aluminum Foams: An Experimental and ANN Model-Based Study
2025 · Dilip Muchhala, Pai Chen Lin, et al. · SSRN Electronic Journal
Experimental and Numerical Investigation on Dynamic Response of Flip Chip Package Under Board Level Drop Test
2024 · Chun-Yu Yen, Chin-Li Kao, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Investigation of process-induced periodic structure on n-type 4H-SiC with corresponding mechanical characteristics estimation
2024 · De-Shin Liu, Po-Chun Wen, et al. · Materials Today Communications
Design High Speed Spindle Cooling System Using Novel Solid-Fluid Coupling Heat Transfer Computational Scheme
2011 · De‐Shin Liu, K. L. Cheng, et al. · ICCES: International Conference on Computational & Experimental Engineering and Sciences
Numerical analysis of moisture diffusion in composite resins containing multiple particles using hybrid moisture element method
2010 · De-Shin Liu, Zhen-Wei Zhuang, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Modeling of multi-layered structure containing heterogeneous material layer with randomly distributed particles using infinite element method
2009 · De-Shin Liu, Zhen-Wei Zhuang, et al. · Microelectronics Reliability
Works count: 22
Citation count: 64
H-index: 4
I10-index: 2
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