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Author

Jinxing Huang

Observed name: Jinxing HUANG
ORCID: 0000-0002-8978-1733
Observed ORCID: 0000-0002-8978-1733
OpenAlex ID: A5060923562
A new model of grit cutting depth in wafer rotational grinding considering the effect of the grinding wheel, workpiece characteristics, and grinding parameters
2021 · Yu Zhang, Renke Kang, et al. · Precision Engineering · 52
Prediction model for surface shape of YAG wafers in wafer rotational grinding
2025 · Jinxing Huang, Renke Kang, et al. · International Journal of Mechanical Sciences · 39
High surface integrity fabrication of silicon wafers using a newly developed nonwoven structured grind-polishing wheel
2022 · Renke Kang, Yu Zhang, et al. · Journal of Manufacturing Processes · 33
Mechanical-chemical synergy in photochemical mechanical polishing monocrystalline yttrium aluminum garnet: An integrated machine learning, response surface, and mathematical methodology
2025 · Xingchen Guo, Jinxing Huang, et al. · Advanced Engineering Informatics · 29
Ultra-low damage processing of silicon wafer with an innovative and optimized nonwoven grind-polishing wheel
2024 · Shang Gao, Jinxing Huang, et al. · Precision Engineering · 16
Synergistic Oxidational Effect of Hydroxyl and Sulfate Radicals Induced an Efficient Removal Mechanism in Photochemical Mechanical Polishing of Yttrium Aluminum Garnet
2025 · Xingchen Guo, Jinxing Huang, et al. · ACS Applied Nano Materials · 8
Influence of grinding-induced damage on scratching behavior and ductile-to-brittle transition of monocrystalline YAG wafers in ultraprecision grinding
2025 · Jinxing Huang, Xingchen Guo, et al. · Tribology International · 7
Catalytic performance and efficient processing mechanism in photocatalysis-assisted chemical mechanical polishing of yttrium aluminum garnet with UV-MnFe2O4/PMS photocatalytic system
2025 · Xingchen Guo, Jinxing Huang, et al. · Colloids and Surfaces A Physicochemical and Engineering Aspects · 6
Effect of abrasives interference on deformation and material removal mechanism of single crystal YAG in abrasive machining
2025 · Shang Gao, Wenjie Song, et al. · Materials Characterization · 6
Influence of grinding damage on the minimum chip thickness and subsurface damage in scratching of YAG wafer
2026 · Jinxing Huang, Zhigang Dong, et al. · Wear · 2
Prediction of brittle-to-ductile transition depth in ultra-precision grinding YAG crystals
2024 · Mengcan AO, Jinxing HUANG, et al. · Optics and Precision Engineering · 2
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The Deformation Pattern of Aluminum Nitride Ceramics Under Nanoscratching
2022 · Honggang Li, Shang Gao, et al. · Smart innovation, systems and technologies · 2
Insight into a novel acetic acid polishing slurry in polishing YAG crystals with the pitch lap
2026 · Hang Dong, Xingchen Guo, et al. · Journal of Physics Conference Series
Atomistic insights into subsurface damage evolution in single-crystal AlN during multi-diamond-abrasive scratching
2026 · Shengbo Li, Renke Kang, et al. · Diamond and Related Materials
Insight into an Efficient Slurry for Chemical Mechanical Polishing of YAG Based on a Pitch Pad
2026 · Shang Gao, Hang Dong, et al. · Langmuir
Saw marks prediction model and experimental verification in multi-wire reciprocating rocking sawing of monocrystalline silicon
2025 · Zhaosong Niu, Jiani Guo, et al. · Journal of Physics Conference Series
Study on subsurface damage depth of multi-wire reciprocating rocking sawing photovoltaic monocrystalline silicon
2025 · Chunzhuang Teng, Changyang Xu, et al. · Journal of Physics Conference Series
Works count: 17
Citation count: 202
H-index: 7
I10-index: 5
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