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Roel Kusters
Observed names:
Kusters, Roel,
R. H. L. Kusters,
R. Kusters,
R.H.L. Kusters,
Roel H. L. Kusters
Institution:
Holst Centre (Netherlands)
Observed institutions:
Netherlands Organisation for Applied Scientific Research,
Holst Centre (Netherlands),
Shell (Netherlands)
OpenAlex ID:
A5061084248
4.5.2 Development of printed RFID sensor tags for smart food packaging
2012
·
Edsger Smits
, Jeroen Schram
, et al.
·
Proceedings IMCS 2012
·
45
PDF
Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending
2014
·
D.A. van den Ende
, H.J. van de Wiel
, et al.
·
Microelectronics Reliability
·
43
Influence of gas injection on phase inversion in an oil–water flow through a vertical tube
2005
·
M. Descamps
, R.V.A. Oliemans
, et al.
·
International Journal of Multiphase Flow
·
39
Fibre Optic Sensing for Improved Wellbore Surveillance
2013
·
Juun van der Horst
, Hans den Boer
, et al.
·
International Petroleum Technology Conference
·
32
Flexible embedded circuitry: A novel process for high density, cost effective electronics
2009
·
Jeroen van den Brand
, Roel Kusters
, et al.
·
Microelectronic Engineering
·
32
Fibre Optic Sensing For Improved Wellbore Production Surveillance
2014
·
Juun van der Horst
, Hans Den Boer
, et al.
·
International Petroleum Technology Conference
·
26
Novel interconnect methodologies for ultra-thin chips on foils
2012
·
A. Sridhar
, M. Cauwe
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
20
Fibre Optic Sensing For Improved Wellbore Production Surveillance
2014
·
Juun van der Horst
, Hans Den Boer
, et al.
·
International Petroleum Technology Conference
·
19
Flipchip bonding of ultrahin Si dies onto PEN/PET substrates with low cost circuitry
2010
·
Jeroen van den Brand
, Roel Kusters
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
19
PDF
Large area flexible lighting foils using distributed bare LED dies on polyester substrates
2013
·
D.A. van den Ende
, R.H.L. Kusters
, et al.
·
Microelectronics Reliability
·
18
Flipchip bonding of thin Si dies onto PET foils: Possibilities and applications
2011
·
van den Brand, Jeroen
, Kusters, Roel
, et al.
·
Ghent University Academic Bibliography (Ghent University)
·
16
PDF
Photonic Flash Soldering of Thin Chips and SMD Components on Foils for Flexible Electronics
2014
·
Daan A. van den Ende
, Rob Hendriks
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
15
A conformable active matrix LED display
2015
·
Ashutosh Tripathi
, Edsger C. P. Smits
, et al.
·
Ghent University Academic Bibliography (Ghent University)
·
13
PDF
High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
2013
·
van den Ende, Daan
, Verhoeven, Frits
, et al.
·
Ghent University Academic Bibliography (Ghent University)
·
10
A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
2012
·
Maarten Cauwe
, Bjorn Vandecasteele
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
7
PDF
49‐2: Invited Paper : Stretchable Passive Matrix LED Display with Thin‐Film Based Interconnects
2016
·
Rik Verplancke
, Maarten Cauwe
, et al.
·
SID Symposium Digest of Technical Papers
·
6
Bonding bare die LEDs on PET foils for lighting applications: Thermal design modeling and bonding experiments
2012
·
D. A. van den Ende
, R. H. L. Kusters
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
6
PDF
A comparative study of via drilling and scribing on PEN and PET substrates for flexible electronic applications using excimer and Nd:YAG laser sources
2009
·
Rajesh Mandamparambil
, Henri Fledderus
, et al.
·
5
Flipchip Bonding of Si Chip on Flexible PEN Foil using Novel Electronic 100 μm Pitch Fan-out Circuitry
2007
·
Jeroen van den Brand
, Erik Veninga
, et al.
·
MRS Proceedings
·
4
Hybrid printed electronics
2016
·
M. M. Koetse
, Edsger C. P. Smits
, et al.
·
TNO Repository
·
3
Additive Fan-Out Panel-Level Processing of MOSFET Devices
2024
·
Eric Rubingh
, Edsger C. P. Smits
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
2
Integration techniques and applications of thin chips on low cost foil substrates
2013
·
Daan van den Ende
, Ashok Sridhar
, et al.
·
Ghent University Academic Bibliography (Ghent University)
·
2
Novel methodology to integrate ultra-thin chips on flexible foils
2012
·
A. Sridhar
, M. Cauwe
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
2
PDF
Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils
2011
·
Maarten Cauwe
, Björn Vandecasteele
, et al.
·
Ghent University Academic Bibliography (Ghent University)
·
2
PDF
Hybrid Integration of OPE
2024
·
Marc Koetse
, Edsger Smits
, et al.
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Works count:
32
Citation count:
386
H-index:
13
I10-index:
14
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