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René H. Poelma

Observed names: Poelma, R.H., Poelma, René, Poelma, René H. (author), R H Poelma, R Poelma, R. H. Poelma, R. Poelma, R.H. Poelma, Rene H. Poelma, Rene Poelma, René H Poelma, René Poelma
ORCID: 0000-0002-4180-7033
Observed ORCID: 0000-0002-4180-7033
OpenAlex ID: A5061448538
An automated hybrid bioelectronic system for autogenous restoration of sinus rhythm in atrial fibrillation
2019 · Emile C. A. Nyns, René H. Poelma, et al. · Science Translational Medicine · 71
High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout
2019 · Brahim El Mansouri, Luke M. Middelburg, et al. · Microsystems & Nanoengineering · 63
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Tailoring the Mechanical Properties of High‐Aspect‐Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings
2014 · René H. Poelma, Bruno Morana, et al. · Advanced Functional Materials · 59
Effects of single vacancy defect position on the stability of carbon nanotubes
2012 · R.H. Poelma, H. Sadeghian, et al. · Microelectronics Reliability · 41
Stretchable Binary Fresnel Lens for Focus Tuning
2016 · Xueming Li, Lei Wei, et al. · Scientific Reports · 38
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A numerical experimental approach for characterizing the elastic properties of thin films: application of nanocantilevers
2011 · R H Poelma, H Sadeghian, et al. · Journal of Micromechanics and Microengineering · 32
Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays
2016 · René H. Poelma, Xuejun Fan, et al. · Advanced Functional Materials · 30
Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis
2016 · Cinzia Silvestri, Michele Riccio, et al. · Nanoscale · 30
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Microstructural and mechanical anisotropy in pressure-assisted sintered copper nanoparticles
2025 · Leiming Du, Kai Liu, et al. · Acta Materialia · 25
Optical ventricular cardioversion by local optogenetic targeting and LED implantation in a cardiomyopathic rat model
2021 · Emile C A Nyns, Tianyi Jin, et al. · Cardiovascular Research · 22
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Effects of Conformal Nanoscale Coatings on Thermal Performance of Vertically Aligned Carbon Nanotubes
2018 · Cinzia Silvestri, Michele Riccio, et al. · Small · 22
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Online Condition Monitoring Methodology for Power Electronics Package Reliability Assessment
2024 · Henry A. Martin, Edsger C. P. Smits, et al. · IEEE Transactions on Power Electronics · 21
Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip
2022 · Hengqian Yi, Efe Ozturk, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 19
Interface strength and crack propagation mechanisms in sintered copper nanoparticles
2025 · Leiming Du, Weiping Jiao, et al. · Acta Materialia · 17
Tailoring microstructure and mechanical properties of sintered Cu nanoparticles
2025 · Leiming Du, Gerald Schaffar, et al. · Acta Materialia · 15
Exploring the process-microstructure-thermal properties relationship of resin-reinforced Ag sintering material for high-power applications via 3D FIB-SEM nanotomography
2024 · Xiao Hu, Henry Antony Martin, et al. · Materials & Design · 11
Establishment of the coarse grained parameters for epoxy-copper interfacial separation
2012 · Cell K. Y. Wong, Stanley Y. Y. Leung, et al. · Journal of Applied Physics · 11
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Thermal characterization methodology for thin bond-line interfaces with high conductive materials
2024 · Henry A. Martin, Sébastien Libon, et al. · Thermal Science and Engineering Progress · 10
Light transmittance in human atrial tissue and transthoracic illumination in rats support translatability of optogenetic cardioversion of atrial fibrillation
2023 · Emile C. A. Nyns, Vincent Portero, et al. · Journal of Internal Medicine · 10
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3D interconnect technology based on low temperature copper nanoparticle sintering
2016 · B. Zhang, Y.C.P. Carisey, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 9
Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration
2016 · H. W. Van Zeijl, Y. Carisey, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 9
The Potential of Machine Learning for Thermal Modelling of SiC Power Modules - A Review
2024 · Zihan Zhang, Alireza Mehrabi, et al. · Electronics System-Integration Technology Conference (ESTC) · 7
Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application
2023 · Henry Martin, Marcia Reintjes, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 7
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Vertically-Aligned Multi-Walled Carbon Nano Tube Pillars with Various Diameters under Compression: Pristine and NbTiN Coated
2020 · Amir Mirza Gheitaghy, René H. Poelma, et al. · Nanomaterials · 7
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Through-polymer-via for 3D heterogeneous integration and packaging
2015 · J. Hamelink, R. H. Poelma, et al. · 7
Works count: 100
Citation count: 690
H-index: 15
I10-index: 19
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