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Koushik Ramachandran

ORCID: 0000-0003-1036-6869
Observed ORCID: 0000-0003-1036-6869
OpenAlex ID: A5061523923
Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon
2014 · Vijay Sukumaran, Gokul Kumar, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 152
An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates
2015 · Katsuyuki Sakuma, Krishna Tunga, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 38
3D Integrated Laser Attach Technology on a 300-mm Monolithic CMOS Silicon Photonics Platform
2023 · Yusheng Bian, Koushik Ramachandran, et al. · IEEE Journal of Selected Topics in Quantum Electronics · 33
Thermomechanical and electrochemical reliability of fine-pitch through-package-copper vias (TPV) in thin glass interposers and packages
2013 · Kaya Demir, Koushik Ramachandran, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 28
Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications
2018 · Kaya Demir, Vijay Sukumaran, et al. · Journal of Materials Science Materials in Electronics · 24
3D Integrated Laser Attach Technology on 300-mm Monolithic Silicon Photonics Platform
2020 · Yusheng Bian, Koushik Ramachandran, et al. · IEEE Photonics Conference · 11
End-to-End Integration of a Multi-die Glass Interposer for System Scaling Applications
2016 · Brittany Hedrick, Vijay Sukumaran, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 11
Integrated Laser Attach Technology on a Monolithic Silicon Photonics Platform
2021 · Yusheng Bian, Koushik Ramachandran, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 8
Conductive Anodic Filament Reliability of Small and Fine-Pitch Through Vias in Halogen-Free Organic Packaging Substrate
2013 · Koushik Ramachandran, Fuhan Liu, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 8
Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates
2012 · Koushik Ramachandran, Fuhan Liu, et al. · Journal of Electronic Materials · 8
Hybrid III-V laser integration on a monolithic silicon photonic platform
2021 · Yusheng Bian, Koushik Ramachandran, et al. · Optical Fiber Communication Conference · 6
Investigation of copper plated-through-holes in glass fiber reinforced epoxy substrates using AC impedance spectroscopy
2015 · Koushik Ramachandran, Timothy L. Pruyn, et al. · Journal of Materials Science Materials in Electronics · 6
Insulation reliability of fine-pitch through-vias in glass fiber reinforced halogen-free epoxy substrates
2014 · Koushik Ramachandran, W. Jud Ready, et al. · Journal of Materials Science Materials in Electronics · 4
Chip-last fan-out package with embedded power ICs in ultra-thin laminates
2012 · Nitesh Kumbhat, Koushik Ramachandran, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Reliability of fine pitch halogen-free organic substrates for green electronics
2011 · Koushik Ramachandran, Fuhan Liu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 3
Monolithic Silicon Photonics
2023 · T. Letavic, Massimo Sorbara, et al. · IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) · 2
Development of robust and cost-effective electrical & optical interconnect solution for high performance silicon photonic applications
2024 · Jae Kyu Cho, Takako Hirokawa, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 1
Mass-Manufacturable Germanium Photodetectors for Beyond-448-Gbps-Class Operation on a Monolithic Silicon Photonics Platform
2026 · Yusheng Bian, Sujith Chandran, et al. · Research Square
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Detachable Glass Waveguide Connector for Co-Packaged Optics on Silicon Photonics platform with <1.5 dB/Facet Passive Coupling and 280 mW Power Handling
2026 · Arpan Dasgupta, Sean Garner, et al. · IEEE Electronic Components and Technology Conference (ECTC)
Monolithic Silicon Photonics for Scalable 200 G/λ Optical Links and Beyond
2026 · Yusheng Bian, Michal Rakowski, et al. · Conference on Lasers and Electro-Optics
High-performance and diverse optical I/O solutions on a 300-mm monolithic CMOS-SiPh platform
2025 · Yusheng Bian, Takako Hirokawa, et al. · Conference on Lasers and Electro-Optics
Evaluation of die to organic laminate to PCB interconnects up to 50GHz
2019 · Selaka Bulumulla, Koushik Ramachandran · IMAPSource Proceedings
Conductive anodic filament reliability of fine-pitch through-vias in organic packaging substrates
2013 · Koushik Ramachandran · SMARTech Repository (Georgia Institute of Technology)
Reliability Studies in Advanced Halogen-free Organic Laminates for Ultra-fine Pitch 3D Packaging
2010 · Koushik Ramachandran, Fuhan Liu, et al. · IMAPSource Proceedings
Works count: 24
Citation count: 347
H-index: 8
I10-index: 7
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