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O. Saliza Azlina

Observed names: O Saliza Azlina, O. Saliza Azlina, O., Saliza Azlina, O.S. Azlina, Osman Saliza Azlina, Osman. Saliza Azlina, Saliza Azlina
ORCID: 0000-0002-5830-7780
Observed ORCID: 0000-0002-5830-7780
OpenAlex ID: A5061694587
Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
2021 · K. Vidyatharran, M.A. Azmah Hanim, et al. · Journal of Materials Research and Technology · 37
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Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
2018 · M.A. Rabiatul Adawiyah, O. Saliza Azlina · Journal of Alloys and Compounds · 35
Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
2022 · T. T. Dele-Afolabi, M. A. Azmah Hanim, et al. · Journal of Materials Science Materials in Electronics · 14
Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish
2020 · M. A. Azmah Hanim, N. Muhamad Kamil, et al. · Journal of Materials Science Materials in Electronics · 12
Effect of Reflow Profile on Intermetallic Compound Formation
2013 · I Siti Rabiatull Aisha, A Ourdjini, et al. · IOP Conference Series Materials Science and Engineering · 12
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The effect of multiple reflow on intermetallic layer of Sn- 4.0AgCu/Cu by using microwave and reflow soldering
2017 · Jaya I Rasbudin, M A Rabiatul Adawiyah, et al. · IOP Conference Series Materials Science and Engineering · 8
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Intermetallic compound formation on lead-free solders by using microwave energy
2016 · S. Mohamad Faizal, O. Saliza Azlina · AIP conference proceedings · 8
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Electroless and Immersion Plating Process towards Structures and IMC Formation
2016 · M.A. Rabiatul Adawiyah, O. Saliza Azlina, et al. · International Journal of Engineering and Technology · 7
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Effect of magnesium fluoride coating on corrosion behaviour of magnesium alloy
2019 · O Saliza Azlina, Mohd Shafiq Ruba’ai, et al. · IOP Conference Series Materials Science and Engineering · 6
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Interfacial reaction between SAC305 lead–free solders and ENImAg surface finish and bare copper
2017 · M.A. Rabiatul Adawiyah, O. Saliza Azlina · Materialwissenschaft und Werkstofftechnik · 6
Effect of Isothermal Aging 2000 Hours on Intermetallics Formed between Ni-Pd-Au with Sn-4Ag-0.5Cu Solders
2013 · M.A. Azmah Hanim, A. Ourdjini, et al. · Advanced materials research · 6
Impact of multiple reflow on intermetallic compound of nickel‐doped tin‐silver‐copper on ENImAg substrate
2020 · M.A. Rabiatul Adawiyah, S.A. Amirul, et al. · Materialwissenschaft und Werkstofftechnik · 5
The Effect of Bismuth on Intermetallics Growth between Lead-Free Solders and Electroless Nickel Immersion Silver (ENIMAG) Surface Finish
2019 · Jaidi Zolhafizi, Saliza Azlina · Key engineering materials · 5
Solder Volume Effect on Interfacial Reaction between Sn-Ag-Cu/ENImAg Substrate
2017 · M.A. Rabiatul Adawiyah, O. Saliza Azlina · Procedia Engineering · 5
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Effect of reflow soldering profile on intermetallic compound formation
2015 · I. Siti Rabiatull Aisha, A. Ourdjini, et al. · International Journal of Computer Applications in Technology · 5
Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishe
2015 · M.A. Azmah Hanim, A. Ourdjini, et al. · JOURNAL OF MECHANICAL ENGINEERING AND SCIENCES · 4
Comparison between SAC405 Lead-Free Solders and EN(P)EPIG and EN(B)EPIG Surface Finishes
2015 · Osman Saliza Azlina, Ali Ourdjini, et al. · Applied Mechanics and Materials · 4
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Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
2013 · M.A. Azmah Hanim, A. Ourdjini, et al. · International Journal of Automotive and Mechanical Engineering · 4
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Shear analysis of rice husk ash (RHA) reinforced tin‐0.7‐copper composite solders on electroless nickel/immersion silver (ENIAg) surfaces
2021 · M.A. Azmah Hanim, C.K. Wei, et al. · Materialwissenschaft und Werkstofftechnik · 3
The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn‐4.0 Ag‐0.5Cu/ENImAg
2019 · M.A. Rabiatul Adawiyah, A.B.M. Hafiz, et al. · Materialwissenschaft und Werkstofftechnik · 3
Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish
2011 · Osman Saliza Azlina, Ali Ourdjini, et al. · Advanced materials research · 3
The Effectiveness Of Bismuth Addition To Retard The Intermetallic Compound Formation
2016 · I. Siti Rabiatull Aisha, A. Ourdjini, et al. · UMP Institutional Repository (Universiti Malaysia Pahang) · 2
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Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG
2016 · O. Saliza Azlina, A. Ourdjini · MATEC Web of Conferences · 2
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The influence of Copper and Bismuth element in Sn-Ag solders and ENIMAG substrate
2019 · Jaidi Zolhafizi, Osman. Saliza Azlina · IOP Conference Series Materials Science and Engineering · 1
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The Development of Low-Temperature Lead-Free Solders using Sn-Bi Solders Alloys
2019 · M. S. Hashim*, O. Saliza Azlina, et al. · International Journal of Recent Technology and Engineering (IJRTE) · 1
Works count: 37
Citation count: 199
H-index: 7
I10-index: 5
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