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Wael Zohni

Stacked chip scale packages: manufacturing issues, reliability results, and cost analysis
2004 · J. Demmin, D. Baker, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 10
Manufacturing readiness of BVA technology for ultra-high bandwidth package-on-package
2014 · Rajesh Katkar, Rey Co, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
High-Volume-Manufacturing (HVM) of BVA enabled advanced Package-on-Package (PoP)
2015 · Rey Co, Rajesh Katkar, et al. · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) · 5
Manufacturing Readiness of BVA™ Technology for Fine-Pitch Package-on-Package
2014 · Rajesh Katkar, Rey Co, et al. · IMAPSource Proceedings · 4
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Cost-minimized double die DRAM packaging for ultra-high performance DDR3 and DDR4 multi-rank server DIMMs
2012 · Richard Crisp, Bill Gervasi, et al. · International Symposium on Quality Electronic Design (ISQED) · 3
High-volume-manufacturing (HVM) of BVA™ enabled advanced package-on-package (PoP)
2015 · Rajesh Katkar, Ashok Prabhu, et al. · International Symposium on Next-Generation Electronics · 1
A 1020-lead, 240 micron pitch, 14 × 14mm Package-on-Package (PoP) and manufacturing infrastructure
2014 · Rajesh Katkar, Rey Co, et al. · International Conference on Electronics Packaging (ICEP) · 1
High density SDRAM package solution for next generation product board applications
2012 · Vern Solberg, Simon McElrea, et al. · Electronic System-Integration Technology Conference (ESTC) · 1
Near term solutions for 3D packaging of high performance DRAM
2011 · Vern Solberg, Wael Zohni · IEEE Electronics Packaging Technology Conference (EPTC) · 1
VI. Synthesis and Analysis
2018 · Wael Zohni · Nomos Verlagsgesellschaft mbH & Co. KG eBooks
III. U.S. Patent Quality Today
2018 · Wael Zohni · Nomos Verlagsgesellschaft mbH & Co. KG eBooks
II. Origins of the U.S. Patent System
2018 · Wael Zohni · Nomos Verlagsgesellschaft mbH & Co. KG eBooks
V. Patent War Yesterday: Wright v Herring-Curtiss
2018 · Wael Zohni · Nomos Verlagsgesellschaft mbH & Co. KG eBooks
VII. Proposals
2018 · Wael Zohni · Nomos Verlagsgesellschaft mbH & Co. KG eBooks
Titelei/Inhaltsverzeichnis
2018 · Wael Zohni · Nomos Verlagsgesellschaft mbH & Co. KG eBooks
Examining the Role of Patent Quality in Large-Scale "Patent War" Litigation
2018 · Wael Zohni · Nomos Verlagsgesellschaft mbH & Co. KG eBooks
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VIII. Conclusion
2018 · Wael Zohni · Nomos Verlagsgesellschaft mbH & Co. KG eBooks
High-Volume-Manufacturing (HVM) of BVA Enabled Advanced Package-On-Package (POP)
2015 · Rajesh Katkar, Ashok S. Prabhu, et al. · SMTA International
BVA™ Technology Enabling the Next Generation of Ultra-Fine Pitch Wide-Io Package-On-Package
2014 · Rajesh Katkar, Rey Co, et al. · Wafer-Level Packaging Symposium
Manufacturing Readiness of BVA™ Technology for Fine-Pitch Package-on-Package
2014 · Rajesh Katkar, Rey Co, et al. · SMTA International
Manufacturing Readiness of BVA(TM) Technology for Fine-Pitch Package-on-Package
2014 · Wael Zohni, Rajesh Katkar, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
Higher Density PoP Semiconductor Packaging Solution: Bridging the Infrastructure Gap Between Wire-Bond and TSV Interconnect
2013 · Vern Solberg, Belgacem Haba, et al. · SMTA International
Bridging the infrastructure gap between traditional wire-bond and TSV semiconductor package technology
2013 · Vern Solberg, Belgacem Haba, et al. · European Microelectronics and Packaging Conference
Thermal Analysis of xFD DRAM Packages Through Simulation and Experimental Validation
2013 · Ron Zhang, John Tseng, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
xFD: A Very Thin Two and Four Die Package Solution for High Performance DDR Sdram
2012 · Vern Solberg, Simon McElrea, et al. · SMTA International
Works count: 28
Citation count: 33
H-index: 4
I10-index: 1
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