Author

Binli Liu

Observed names: Bin‐Li Liu, Liu Bin-Li

Institution: Naval University of Engineering

Observed institution: Naval University of Engineering

ORCID: 0000-0002-9214-2182

Observed ORCID: 0000-0002-9214-2182

OpenAlex ID: A5062233667

Lifting-Off of Al Bonding Wires in IGBT Modules Under Power Cycling: Failure Mechanism and Lifetime Model

2019 · Yongle Huang, Yingjie Jia, et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 99

Failure Mechanism of Die-Attach Solder Joints in IGBT Modules Under Pulse High-Current Power Cycling

2018 · Yongle Huang, Yifei Luo, et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 75

PSpice-COMSOL-Based 3-D Electrothermal–Mechanical Modeling of IGBT Power Module

2019 · Yingjie Jia, Fei Xiao, et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 71

Fatigue Mechanism of Die-Attach Joints in IGBTs Under Low-Amplitude Temperature Swings Based on 3D Electro-Thermal-Mechanical FE Simulations

2020 · Yongle Huang, Hongfei Deng, et al. · IEEE Transactions on Industrial Electronics · 52

A Physics-Based Transient Electrothermal Model of High-Voltage Press-Pack IGBTs Under HVdc Interruption

2019 · Yifei Luo, Fei Xiao, et al. · IEEE Transactions on Power Electronics · 32

A Multi-timescale Prediction Model of IGBT Junction Temperature

2018 · Binli Liu, Fei Xiao, et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 31

Evaluation of the Degradation in Electrothermal Characteristics of IGBTs During Thermal Cycling Cocaused by Solder Cracking and Al-Wires Lifting-Off Based on Iterative Looping

2022 · Yongle Huang, Yifei Luo, et al. · IEEE Transactions on Power Electronics · 23

Simulation model and parameter extraction of Field-Stop (FS) IGBT

2012 · Yong Tang, Bo Wang, et al. · Microelectronics Reliability · 23

Temporal and Spatial Differences in Thermal Transfer Behavior of IGBTs Caused by the Baseplate and Die-Attach Solder Cracking

2022 · Yongle Huang, Yifei Luo, et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 18

A Reduced-Order Decoupling Method Applied to Efficient Junction Temperature Simulation Model in Multichip Devices

2023 · Tongyao Han, Yifei Luo, et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 17

A Physics-Based Lumped-Charge Model for SiC MPS Diode Implemented in PSPICE

2019 · Yaoqiang Duan, Fei Xiao, et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 14

Stray Inductance Extraction of High-Power IGBT Dynamic Test Platform and Verification of Physical Model

2018 · Xin Li, Yifei Luo, et al. · IEEE International Power Electronics and Application Conference and Exposition (PEAC) · 14

Temperature monitoring inside IGBT modules at forward bias from the cross section and its finite element analysis

2018 · Yongle Huang, Yifei Luo, et al. · Microelectronics Reliability · 13

A Voltage Model of p-i-n Diodes at Reverse Recovery Under Short-Time Freewheeling

2016 · Yifei Luo, Fei Xiao, et al. · IEEE Transactions on Power Electronics · 13

A Lumped-Charge Model for High-Power PT-p-i-n Diode With a Buffer Layer

2019 · Xin Li, Yifei Luo, et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 12

Modeling method for electrothermal cosimulation of high‐power IGBT

2019 · Ying‐Jie Jia, Fei Xiao, et al. · IEEJ Transactions on Electrical and Electronic Engineering · 11

The Investigation on the Lifetime Prediction Model of IGBT Module

2011 · Binli Liu, Dezhi Liu, et al. · Energy Procedia · 10

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Investigation into the turn-off mechanism and time of IGBT based on voltage and current

2013 · Liu Bin-Li, Liu De-Zhi, et al. · Acta Physica Sinica · 6

Mechanism Analysis of Bond Wire Degradation Leading to the Increase of IGBT Collector-Emitter Voltage

2018 · Yingjie Jia, Yaoqiang Duan, et al. · IEEE International Power Electronics and Application Conference and Exposition (PEAC) · 5

Investigation into the reverse recovery voltage peak mechanism of freewheeling diode at a switching transition

2014 · Luo Yi-Fei, Xiao Fei, et al. · Acta Physica Sinica · 5

Evaluation on the electro-thermal instability process of thermal runaway under high temperature based on TCAD

2024 · Xiao Ma, Yongle Huang, et al. · Microelectronics Reliability · 4

Parameter Correction Method of Vce(on)-Based Junction Temperature Estimation Model Based on Bonding Wire Fatigue

2024 · Hao Yuan, Binli Liu, et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 3

Short-Duration Transient Temperature Distribution Prediction Model along Chip Vertical Path Applicable to Multi-Timescale Simulation

2022 · Tongyao Han, Yifei Luo, et al. · Energies · 3

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Investigation of the prediction model of IGBT junction temperature based on the rate of voltage change

2014 · Liu Bin-Li, Tang Yong, et al. · Acta Physica Sinica · 3

Failure Mechanism and Lifetime Prediction Modeling of IGBT Power Electronic Devices

2011 · Binli Liu · Xi'an Jiaotong Daxue xuebao · 3

Works count: 37

Citation count: 569

H-index: 13

I10-index: 17