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Mihai Daraban

Observed names: M. Daraban, Mihai Dărăban
ORCID: 0000-0003-4864-8095
Observed ORCID: 0000-0003-4864-8095
OpenAlex ID: A5062920473
Availability of an RFID Object-Identification System in IoT Environments
2021 · Cosmina Corches, Mihai Daraban, et al. · Sensors · 13
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Protocol over UART for Real-Time Applications
2021 · Mihai Daraban, Cosmina Corches, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 12
Statistical information of crosstalk on parallel bus
2011 · Mihai Daraban, Dan Pitica · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 6
Analyzing crosstalk effects on a parallel bus using eye diagram
2011 · Mihai Daraban, Dan Pitica · International Spring Seminar on Electronics Technology · 4
Analyzing the RFID Failure Impact on Availability of IoT Services
2020 · C. Corches, I. C. Donca, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 3
XpertTrack: Precision Autonomous Measuring Device Developed for Real Time Shipments Tracker
2016 · Liviu Viman, Mihai Daraban, et al. · Sensors · 3
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Forbidden switching patterns to mitigate crosstalk on parallel data buses — CODEC design
2012 · Mihai Daraban, Dan Pitica · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 3
The influence of capacitive discontinuity in signal integrity on PCB traces
2010 · Mihai Daraban, Dan Pitica · International Spring Seminar on Electronics Technology · 3
Embedded RTOS for a Smart RFID Reader
2019 · C. Corches, O. Stan, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 2
Software instrument for testing cluster devices using high-speed CAN protocol
2017 · Marius Alexandru Taut, Mihai Daraban, et al. · International Spring Seminar on Electronics Technology · 2
Progressive transmission line matching when encountering via mismatching
2013 · Mihai Daraban, Dan Pitica · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 2
Comparison of Signal Integrity Simulation Tools: HyperLynx vs. Keysight ADS on eMMC Interfaces
2025 · Octavian-Constantin Axinte, Vlad Veliciu, et al. · International Spring Seminar on Electronics Technology · 1
Enhanced Gas Monitoring for Automated Greenhouses
2025 · Vlad Veliciu, Octavian-Constantin Axinte, et al. · International Spring Seminar on Electronics Technology · 1
Signal Integrity Analysis on eMMC Interface
2024 · O. C. Axinte, M. Daraban · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 1
Technologies of Interconnections in Electronics – Signal and Power Integrity Student Contest
2024 · M. Daraban, M. Manofu, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 1
Real-Time Embedded Framework Debugger
2022 · Mihai Daraban, Cosmina Corches, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 1
Interconnection of Systems with Cloud-Fog-Edge architectures: Concept and Challenges
2021 · Cosmina Corches, Mihai Daraban, et al. · Journal of Control Engineering and Applied Informatics · 1
Mathematical analysis to control power transfer in resonant power converters
2015 · Adrian Taut, Mihai Daraban, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 1
A SPICE analysis on how PDNs can benefit from Crosstalk Avoidance Code
2015 · Mihai Daraban, Raul Fizesan, et al. · International Spring Seminar on Electronics Technology · 1
Bus encoding algorithm to reduce crosstalk effects
2012 · Mihai Daraban, Dan Pitica · International Spring Seminar on Electronics Technology · 1
Capacitive discontinuity in cross talk effect
2010 · Mihai Daraban, Dan Pitica · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 1
Simulation-Based Comparative Analysis of Signal Integrity in an RGMIIv2.0 Interface Using CST Studio and Keysight ADS
2025 · Cătălin-Ionuț Oprița, Octavian-Constantin Axinte, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)
Concept and Challenges in Microcontroller Artificial Intelligence Development
2024 · Cosmina Corches, Adelina Ioana Ilieş, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)
Power Integrity Analysis of a Power Line Between a DDR4 Memory and a Controller
2024 · A. I. Marina, M. Daraban · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)
Monitoring Hospital Activity Through Petri Nets
2023 · Cosmina Corches, Mihai Daraban, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)
Works count: 34
Citation count: 63
H-index: 4
I10-index: 2
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