Get started
Author

Wenkun Yang

Observed names: W. Yang, Wen-Kun Yang, Wen‐Kun Yang
Institution: Hohai University
ORCID: 0000-0001-9962-4179
Observed ORCID: 0000-0001-9962-4179
OpenAlex ID: A5063041875
Calibration of micro-scaled mechanical parameters of granite based on a bonded-particle model with 2D particle flow code
2019 · Chong Shi, Wenkun Yang, et al. · Granular Matter · 102
Feedback on a shared big dataset for intelligent TBM Part I: Feature extraction and machine learning methods
2023 · Jian-Bin Li, Zu-Yu Chen, et al. · Underground Space · 99
Significance and methodology: Preprocessing the big data for machine learning on TBM performance
2022 · Hao-Han Xiao, Wen-Kun Yang, et al. · Underground Space · 95
PDF
Feedback on a shared big dataset for intelligent TBM Part II: Application and forward look
2023 · Jian-Bin Li, Zu-Yu Chen, et al. · Underground Space · 69
Feature fusion method for rock mass classification prediction and interpretable analysis based on TBM operating and cutter wear data
2025 · Wenkun Yang, Zuyu Chen, et al. · Tunnelling and Underground Space Technology · 39
Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact
2008 · Chan-Yen Chou, Tuan-Yu Hung, et al. · Microelectronics Reliability · 28
Numerical simulation of column charge explosive in rock masses with particle flow code
2019 · Junxiong Yang, Chong Shi, et al. · Granular Matter · 27
Excavation rate “predicting while tunnelling” for double shield TBMs in moderate strength poor to good quality rocks
2021 · Baogang Mu, Wenkun Yang, et al. · International Journal of Rock Mechanics and Mining Sciences · 21
Reliability analysis of a novel fan‐out type WLP
2009 · Ming‐Chih Yew, Mars Tsai, et al. · Soldering and Surface Mount Technology · 14
Investigation of stress-buffer-enhanced package subjected to board-level drop test
2008 · Chan-Yen Chou, Tuan-Yu Hung, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 11
Factorial Analysis of Chip-on-Metal WLCSP Technology with Fan-Out Capability
2006 · M.c. Yew, C. Yuan, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 10
Improved Boreability Index for Gripper TBMs in Medium- to Strong-Quality Rocks Based on Theoretical Analysis and Field Penetration Tests
2025 · Wenkun Yang, Zuyu Chen, et al. · Rock Mechanics and Rock Engineering · 8
Numerical simulation for compressive and tensile behaviors of rock with virtual microcracks
2021 · Xiao Chen, Chong Shi, et al. · Arabian Journal of Geosciences · 7
Study of Anti-Sliding Stability of a Dam Foundation Based on the Fracture Flow Method with 3D Discrete Element Code
2017 · Chong Shi, Wenkun Yang, et al. · Energies · 7
PDF
Physical feature shared online transfer learning framework for cross-engineering rock mass quality perception during TBM excavation
2025 · Wenkun Yang, Zuyu Chen, et al. · Tunnelling and Underground Space Technology · 6
EKTFD: Precise-guided empirical knowledge and time-frequency domain data joint-driven machine learning method for rock mass intelligent perception
2025 · Wenkun Yang, Zuyu Chen, et al. · Tunnelling and Underground Space Technology · 2
Defect estimation of aircraft and aerospace components based on Neural Network using Lock-in thermography
2010 · L. Junyan, L. Huijuan, et al. · International Conference on Quantitative InfraRed Thermography (QIRT) · 1
PDF
Reliability Analysis of the Panel Base Package (PBP¿) Technology with Enhanced Cover Layer
2008 · Ming-Chih Yew, Chun-Fai Yu, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 1
Works count: 18
Citation count: 547
H-index: 10
I10-index: 11
Year
Topic
Type