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Siang Miang Yeo

Vacuum Reflow Process Optimization for Solder Void Size Reduction in Semiconductor Packaging Assembly
2022 · Siang Miang Yeo, Ho-Kwang Yow, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 17
Vacuum Reflow Process Characterization for Void-Less Soldering Process in Semiconductor Package
2018 · Siang Miang Yeo, Azman Mahmood, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 17
Solder void size reduction in semiconductor package by vacuum reflow and pressure cure processes
2022 · Siang Miang Yeo, Ho Kwang Yow, et al. · Soldering and Surface Mount Technology · 9
Critical Threshold Limit for Effective Solder Void Size Reduction by Vacuum Reflow Process for Power Electronics Packaging
2023 · Siang Miang Yeo, Ho-Kwang Yow, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 4
Lead-Free BiSnAg Soldering Process for Voidless Semiconductor Packaging
2023 · Siang Miang Yeo, Ho-Kwang Yow, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 3
Die Pop Challenge and Comprehensive Solutions in Vacuum Reflow Technology for Semiconductor Packaging
2018 · Siang Miang Yeo, Azman Mahmood, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 3
Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathin Die With Warpage in Semiconductor Packaging Assembly
2023 · Siang Miang Yeo, Ho Kwang Yow, et al. · IEEE Transactions on Reliability · 2
Laser Ablation Dicing Revolutionizes Ultra-thin Wafer Saws Beyond the Capability of Blade Dicing
2024 · Siang Miang Yeo · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 1
Next Generation Board Level Underfill (BLUF) for Fine Pitch BGA and POP
2010 · Siang Miang Yeo, Cheng Siew Tay, et al. · SMTA International
Works count: 9
Citation count: 56
H-index: 4
I10-index: 2
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