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Teck Kheng Lee
Observed names:
Lee Teck Kheng,
Teck Lee
Institution:
Institute of Technical Education
Observed institutions:
Shandong University,
Nanyang Technological University,
Micron (Singapore),
State Key Laboratory of Crystal Materials,
Institute of Technical Education
ORCID:
0000-0003-1038-1188
Observed ORCID:
0000-0003-1038-1188
OpenAlex ID:
A5065245839
Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging
2013
·
Chwee Goh
, Wee Chong
, et al.
·
Crystals
·
73
PDF
Effects of Sterilization Cycles on PEEK for Medical Device Application
2018
·
Amit Kumar
, Wai Teng Yap
, et al.
·
Bioengineering
·
54
PDF
A Novel and Low-Cost Cloud-Enabled IoT Integration for Sustainable Remote Intravenous Therapy Management
2024
·
Chiang Liang Kok
, Chee Kit Ho
, et al.
·
Electronics
·
35
Interfacial microstructures and kinetics of Au/SnAgCu
2005
·
Teck Kheng Lee
, Sam Zhang
, et al.
·
Thin Solid Films
·
34
A Novel Low-Cost Capacitance Sensor Solution for Real-Time Bubble Monitoring in Medical Infusion Devices
2024
·
Chiang Liang Kok
, Yuwei Dai
, et al.
·
Electronics
·
23
PDF
A Novel and Self-Calibrating Weighing Sensor with Intelligent Peristaltic Pump Control for Real-Time Closed-Loop Infusion Monitoring in IoT-Enabled Sustainable Medical Devices
2024
·
Chiang Liang Kok
, Chee Kit Ho
, et al.
·
Electronics
·
20
Needle Insertion Forces Studies for Optimal Surgical Modeling
2013
·
Ka Wei Ng
, Jin Quan Goh
, et al.
·
International Journal of Bioscience Biochemistry and Bioinformatics
·
17
Effects of moisture on reliability of gold and copper ball bonds
2010
·
C. D. Breach
, Ng Hun Shen
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
15
Dissolution and reaction between Au and molten eutectic PbSn solder
2006
·
Teck Kheng Lee
, Sam Zhang
, et al.
·
Materials Science and Engineering A
·
14
Assessment of Fluxless Solid Liquid Interdiffusion Bonding by Compressive Force of Au-PbSn and Au-SAC for Flip Chip Packaging
2009
·
Teck Kheng Lee
, Sam Zhang
, et al.
·
IEEE Transactions on Advanced Packaging
·
13
Moisture induced corrosion in gold and copper ball bonds
2010
·
C. D. Breach
, Tee Wai Mun
, et al.
·
IEEE/CPMT International Electronics Manufacturing Technology Symposium
·
12
Instantaneous fluxless bonding of Au with Pb–Sn solder in ambient atmosphere
2005
·
Teck Kheng Lee
, Sam Zhang
, et al.
·
Journal of Applied Physics
·
12
The effect of ball pad designs and substrate materials on the performance of second-level interconnects
2004
·
A.C.P. Lim
, Lee Teck Kheng
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
12
Comparsion of Au/Al and Cu/Al in wirebonding assembly and reliability
2011
·
Teck Kheng Lee
, C. D Breach
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
10
Design and Testing of an Intramedullary Nail Implant Enhanced with Active Feedback and Wireless Connectivity for Precise Limb Lengthening
2024
·
Chiang Liang Kok
, Tat Chin Tan
, et al.
·
Electronics
·
9
PDF
Oxidation and corrosion of Au/Al and Cu/Al in wire bonding assembly
2012
·
Teck Kheng Lee
, C.D Breach
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
9
Needle Deflection Studies for Optimal Insertion Modeling
2013
·
Ka Wei Ng
, Jin Quan Goh
, et al.
·
International Journal of Bioscience Biochemistry and Bioinformatics
·
8
Failure of gold and copper ball bonds due to intermetallic oxidation and corrosion
2011
·
C. D. Breach
, Ng Hun Shen
, et al.
·
IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
·
7
Blynk-Enabled IoT Control of Sustainable Biomedical Active Implants
2024
·
Chiang Liang Kok
, Chee Kit Ho
, et al.
·
International Conference on Electronics Technology (ICET)
·
6
Enhancement of moisture sensitivity performance of a FBGA
2002
·
Lee Teck Kheng
, Lee Kian Chai
, et al.
·
International Symposium on Electronic Materials and Packaging (EMAP)
·
5
Fluxless flip chip bonding with joint-in-via architecture
2005
·
Teck Kheng Lee
, Sam Zhang
, et al.
·
Thin Solid Films
·
4
Comparison of SLICF with C4 for flip chip bonding with Au, Cu, Pd and Ag studs with SAC solder
2013
·
Lee Teck Kheng
, Ser Bok Leng
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
3
Prototyping of low-cost wafer level packages
2011
·
Haoyang Chen
, Tong Yan Tee
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
3
Assessment of Fluxless Solid Liquid Interdiffusion Bonding by Compressive Force of Au-PbSn and Au-SAC for Flip Chip Packaging
2007
·
Teck Kheng Lee
, Sam Zhang
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
3
Material and design considerations of FBGA reliability performance
2004
·
Teck Kheng Lee
, Teng Chye Ng
, et al.
·
Thin Solid Films
·
3
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Works count:
43
Citation count:
414
H-index:
12
I10-index:
14
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