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Shixuan Gao

Observed name: Shi-Xuan Gao
ORCID: 0000-0002-3176-2724
Observed ORCID: 0000-0002-3176-2724
OpenAlex ID: A5065248210
DRIE Trenches and Full-Bridges for Improving Sensitivity of 2-D Micromachined Silicon Thermal Wind Sensor
2017 · Yizhou Ye, Zhenxiang Yi, et al. · Journal of Microelectromechanical Systems · 59
Octagon-Shaped 2-D Micromachined Thermal Wind Sensor for High-Accurate Applications
2018 · Yizhou Ye, Zhenxiang Yi, et al. · Journal of Microelectromechanical Systems · 28
Effect of Insulation Trenches on Micromachined Silicon Thermal Wind Sensors
2017 · Yizhou Ye, Zhenxiang Yi, et al. · IEEE Sensors Journal · 19
A Low-Complexity In-Run Modal Frequency Tuning Method for MEMS Disk Gyroscopes Without Gain Calibration and Phase Shifting
2024 · Jia Jia, Ziqi Song, et al. · IEEE Transactions on Instrumentation and Measurement · 18
Configuration of a Self-Heated Double Wheatstone Bridge for 2-D Wind Sensors
2018 · Shixuan Gao, Zhenxiang Yi, et al. · Journal of Microelectromechanical Systems · 16
Temperature Effect and Its Compensation of a Micromachined 2-D Anemometer
2019 · Shixuan Gao, Zhenxiang Yi, et al. · IEEE Sensors Journal · 14
Bandwidth Expansion for Force-to-Rebalance Measurement of MEMS Gyroscopes Based on Equivalent Unit Negative Feedback Loop
2025 · Jia Jia, Ziqi Song, et al. · IEEE/ASME Transactions on Mechatronics · 11
Braiding-process-induced damage and deformation of three-dimensional braided preform: A numerical investigation
2025 · Mengyuan Zhang, Xingzhong Gao, et al. · Composite Structures · 5
Phase error analysis for MEMS gyroscopes operational modes based on force-to-rebalance rate measurement mode
2026 · Jia Jia, Han Zhang, et al. · Microsystems & Nanoengineering · 4
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Technical Function-effect Based Patent Multi-to-One Negation Game Model
2022 · Lu Du, Weidong Liu, et al. · International Conference on Computer Supported Cooperative Work in Design (CSCWD) · 2
Reliability Optimization of a 3D Packaged Micro-machined Wind Sensor
2018 · Shi-Xuan Gao, Qing-An Huang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Design and optimization of thermal-mechanical reliability of a TSV 3D Packaged Thermal Wind Sensor
2017 · Shixuan Gao, Zhenxiang Yi, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
An Improved Wet‐Spinning Strategy for Preparing Thermal‐Insulating UHMWPE Fibers and Their Application in Lightweight, Cut‐Resistant Functional Fabrics
2026 · Shixuan Gao, Xingzhong Gao, et al. · Small · 1
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Simultaneous image deblurring and inpainting via convolutional sparse coding
2021 · ShengBiao Wang, Bolun Chen, et al. · Optoelectronic Imaging and Multimedia Technology · 1
Stable bandwidth expansion for FTR measurement in modal-frequency-mismatched MEMS gyroscopes over a wide temperature range
2026 · Jia Jia, Yuezhen Wang, et al. · Mechanical Systems and Signal Processing
Works count: 15
Citation count: 182
H-index: 7
I10-index: 7
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